Interposer Terminal Cutting Reduces Piezoelectric Noise
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Solution Overview
Problem
Multilayer electronic components, particularly capacitors with piezoelectric properties, generate acoustic noise and high-frequency vibrations that can be perceived as abnormal sounds or interfere with audio outputs, and these vibrations can cause errors in IT sensors due to frequencies above 20 kHz.
Innovation Solution
The electronic component incorporates a multilayer capacitor with an interposer and external terminals, featuring a conductive adhesive layer and a specific design for the side connection portion with a cutting portion that reduces acoustic noise and high-frequency vibrations by optimizing the thickness ratio of the terminal's components, thereby enhancing adhesion strength and minimizing noise transmission to a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer capacitor with piezoelectric dielectric material is used, then the capacitor can be synchronized to applied voltage and changed, but acoustic noise is generated when voltage period is within audible frequency band
Solution Approach 1:
An interposer is introduced as an intermediary component between the multilayer capacitor and the substrate. The interposer includes an interposer body with external terminals that have connection portions, mounting portions, and side connection portions with cutting portions. This intermediary structure decouples the vibration transmission path, preventing acoustic noise from being transmitted to the substrate while maintaining the capacitor's electrical functionality.
Solution Approach 2:
The external terminal of the interposer is segmented into multiple portions: connection portion, mounting portion, and side connection portion with cutting portions. The side connection portion is further divided with cutting portions that create discrete segments. This segmentation disrupts the continuous vibration transmission path, effectively reducing acoustic noise while maintaining electrical connectivity.
2Ease of manufacture
If the side connection portion has uniform thickness, then manufacturing is simple, but adhesion strength is insufficient and mounting defects occur
Solution Approach 1:
The side connection portion is designed with non-uniform thickness distribution, creating local quality variations. Specifically, the thickness varies along the length of the side connection portion, with thicker regions providing enhanced adhesion strength for secure mounting and thinner regions facilitating manufacturing. This local quality optimization ensures both strong adhesion and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces acoustic noise in the audible frequency range and high-frequency vibrations, preventing errors in IT sensors and ensuring secure adhesion and reduced mounting defects, thus improving the overall performance and reliability of the electronic component.
Implementation Method 1
a conductive adhesive layer disposed between the external electrode and the connection portion
Implementation Method 2
As the dielectric material has piezoelectric properties, the dielectric material may be synchronized to an applied voltage and may be changed
Data Source
AI summary
An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.