Interposer Terminal Merging for Compact Radiation Detector Design
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Solution Overview
Problem
As the number of pixels in a radiation sensor increases, the number of input/output terminals of the interposer connecting the sensor and the ASIC also increases, leading to a larger chip size and overall radiation detector size.
Innovation Solution
The radiation detector design includes a semiconductor substrate with a radiation sensor having multiple pixels, an integrated circuit for signal processing, and an interposer that electrically connects the sensor and the integrated circuit. The interposer has a smaller number of terminals on its second surface facing the integrated circuit, connected to a larger number of terminals on its first surface facing the radiation sensor, which are connected to the pixels. This configuration reduces the number of wiring patterns and layers in the interposer, thereby suppressing the increase in detector size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of pixels in the radiation sensor is increased, then the detection capability and resolution are improved, but the number of input/output terminals of the interposer increases, leading to a larger chip size and overall radiation detector size
Solution Approach 1:
Multiple first terminals connected to second electrodes are electrically connected to a single second terminal through the interposer. This merging approach reduces the number of wiring patterns and layers required in the interposer, thereby suppressing the increase in detector size while maintaining the ability to handle signals from an increased number of pixels
Solution Approach 2:
The interposer is designed to handle multiple functions: it provides electrical connection between the radiation sensor and integrated circuit, reduces terminal count through selective connection, and maintains signal integrity for pixel selection. The selection circuit enables the system to selectively activate specific second electrodes, making the detector adaptable to different detection modes without requiring physical reconfiguration
2Adaptability or versatility
If the number of terminals of the interposer is increased, then the number of pixels that can be connected is increased, but the area where terminals are arranged increases, thereby increasing the chip size of the ASIC
Solution Approach 1:
The interposer merges multiple first terminals to a single second terminal through selective electrical connections. This reduces the total number of terminals that need to be arranged on the ASIC chip surface, thereby reducing the chip size while still maintaining connectivity to all pixels through the selection circuit mechanism
3Adaptability or versatility
If the number of wiring patterns and layers in the interposer is increased, then the number of terminals that can be connected is increased, but the complexity and size of the interposer increases
Solution Approach 1:
By merging multiple first terminals to single second terminals, the number of required wiring patterns and layers in the interposer is reduced. This simplifies the interposer structure and reduces manufacturing complexity while still providing the necessary connectivity for multiple pixels through the selection circuit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the increase in the size of the radiation detector by reducing the number of wiring patterns and layers in the interposer, maintaining a compact detector size even with an increasing number of pixels.
Implementation Method 1
a semiconductor substrate configured to convert incident radiation into charges
Data Source
AI summary
A radiation detector comprising a radiation sensor obtained by arranging first electrodes on a semiconductor substrate configured to convert incident radiation into charges, an integrated circuit, and an interposer is provided. The interposer comprises first terminals arranged on a first surface facing the sensor and connected to the first electrodes, and second terminals arranged on a second surface facing the integrated circuit and connected to the integrated circuit. Each of the first terminals is connected to one second terminal. The number of the second terminals is smaller than the first terminals. The substrate comprises a third surface on which the first electrodes are arranged and a fourth surface on which second electrodes are arranged. The detector further comprises a selector configured to select the second electrode from the second electrodes to supply a potential for converting the incident radiation into charges.


