Interposer Terminal Design for Multilayer Capacitor Mounting Strength
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Solution Overview
Problem
Existing electronic components using interposers to reduce acoustic noise from multilayer capacitors are ineffective in maintaining sufficient fixing strength during board mounting, leading to poor mounting issues.
Innovation Solution
An electronic component design featuring a multilayer capacitor with external electrodes and an interposer having specific terminal configurations, including bonding and mounting portions of varying lengths, and made of alumina, to enhance fixing strength while reducing acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is disposed between a multilayer capacitor and a board to reduce acoustic noise, then acoustic noise is reduced, but fixing strength during board mounting deteriorates
Solution Approach 1:
The external terminals of the interposer are segmented into bonding portions (for connecting to the capacitor) and mounting portions (for connecting to the board), with the mounting portions extending longer than the bonding portions. This segmentation allows the mounting portions to provide enhanced mechanical anchoring strength while the bonding portions maintain acoustic isolation, thus resolving the contradiction between noise reduction and fixing strength
Solution Approach 2:
The external terminals extend in multiple directions: bonding portions extend from the top surface of the interposer body, while mounting portions extend from the bottom surface. This three-dimensional configuration allows the mounting portions to engage deeper with the board for stronger fixing, while the bonding portions remain positioned for acoustic isolation functionality
2Reliability
If the interposer is designed with specific terminal configurations to improve fixing strength, then mounting reliability is improved, but acoustic noise reduction effectiveness may deteriorate
Solution Approach 1:
Different portions of the external terminals have different lengths and functions: bonding portions are optimized for acoustic isolation (shorter length), while mounting portions are optimized for mechanical strength (longer length). This local differentiation of properties allows each portion to perform its specific function optimally without compromising the other
Solution Approach 2:
The interposer serves as an intermediary component between the multilayer capacitor and the board, with its external terminals mediating both the mechanical connection and acoustic isolation. The specific configuration of bonding and mounting portions allows the interposer to simultaneously provide reliable mounting while maintaining acoustic noise reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively secures fixing strength and reduces acoustic noise by optimizing the lengths of the interposer's external terminal portions, preventing poor mounting and maintaining noise reduction above a predetermined level.
Implementation Method 1
The dielectric layers have piezoelectric properties. Accordingly, when a DC or an AC voltage is applied to the multilayer capacitor, a piezoelectric phenomenon may occur between the internal electrodes to generate periodic vibrations while expanding and contracting a capacitor body.
Implementation Method 2
an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively
Data Source
AI summary
An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.