Interposer Test Structure for Rapid Defect Detection
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Solution Overview
Problem
The high cost and complexity of manufacturing interposers using silicon substrates hinder their mass production, and existing defect detection methods are inefficient, requiring expensive and time-consuming equipment for electric open/short defect testing.
Innovation Solution
An interposer with a substrate featuring a test structure including conductive plugs, line pattern groups, and pads allows for rapid detection of electric open/short defects by generating and analyzing data from these components, enabling efficient manufacturing and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an interposer uses a silicon substrate for fine processing, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The interposer structure is segmented into distinct functional regions: a mounting area for semiconductor chips and a test area for defect detection. This segmentation allows the test structure to be independently designed and manufactured, simplifying the overall manufacturing process while maintaining fine processing capabilities in critical areas.
Solution Approach 2:
The test structure includes line pattern groups that are copied from the actual interconnect structures. These test line patterns are formed in the test area using the same manufacturing processes, allowing verification of fine processing quality without requiring separate complex testing equipment.
2Measurement precision
If traditional defect detection methods are used, then measurement accuracy is achieved, but loss of time and productivity decrease
Solution Approach 1:
The test structure is built into the interposer during the manufacturing process itself, before the interposer is assembled into the final semiconductor package. This preliminary integration of test structures allows defect detection to be performed early in the manufacturing flow, eliminating the need for time-consuming post-assembly testing.
Solution Approach 2:
The interposer performs its own self-testing through the integrated test structure. The line pattern groups and conductive plugs form complete test circuits that can be electrically tested using standard semiconductor testing equipment, allowing the interposer to verify its own quality without requiring external specialized testing apparatus.
3Measurement precision
If expensive specialized testing equipment is used, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The test structure uses simplified copied versions of the actual interconnect structures. The line pattern groups in the test area replicate the geometry and material composition of the mounting area interconnects, allowing standard semiconductor testing equipment to be used for defect detection without requiring expensive specialized testing apparatus.
Solution Approach 2:
The test structure is designed to be tested using the same equipment and methodologies as the production structures. The conductive plugs and line patterns form electrical circuits that can be tested with standard parametric testing equipment, making the testing process universal and eliminating the need for expensive specialized testing equipment.
Data Source
AI summary
An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.