Interposer Testing Pad Layout for Compact Stacked Semiconductor Packaging
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in efficiently integrating and testing stacked semiconductor devices while minimizing their physical size and ensuring reliable electrical connectivity, particularly in the context of bonded semiconductor structures.
Innovation Solution
Incorporating testing pads within the active region of an interposer and forming them in the scribe line region, followed by removal through sawing operations, which allows for reduced overall size and efficient testing of circuitry in stacked semiconductor structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Difficulty of detecting and measuring
If testing pads are formed within the active region of an interposer, then testing capabilities are enhanced, but area occupancy increases
Solution Approach 1:
The patent places testing pads in the scribe line region (peripheral dimension) rather than the active die area (central dimension), utilizing the peripheral space for testing functions. This dimensional repositioning allows testing capabilities to be enhanced without consuming valuable active region area, as the scribe line region is typically used for device separation rather than active circuitry.
2Area of stationary object
If testing pads are removed through sawing operations, then overall size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent combines the testing pad removal process with the existing singulation sawing operation. By integrating the removal of testing pads into the same sawing step used for separating individual devices, the manufacturing process achieves size reduction without adding separate removal steps. This merging of operations reduces overall manufacturing complexity despite the additional function being performed.
3Productivity
If stacked semiconductor devices are bonded together, then integration density is improved, but reliability of electrical connectivity becomes more challenging
Solution Approach 1:
The patent implements testing pads that enable electrical connectivity verification before the stacking and bonding processes. By performing testing operations on the interposer and attached devices while they are still accessible and flat, the system can identify and address connectivity issues prior to three-dimensional stacking. This preliminary testing action ensures reliability is validated early in the manufacturing sequence, before subsequent bonding operations make testing more difficult.
Data Source
AI summary
A method of manufacturing a semiconductor structure, comprising: disposing a dielectric layer over a semiconductive wafer defined with a plurality of active regions and a scribe line region surrounding each of the plurality of active regions; forming a plurality of interconnect structures within the dielectric layer, wherein the formation of the plurality of interconnect structures includes forming a plurality of first testing pads within the scribe line region and at least partially exposed through the dielectric layer; and sawing the semiconductive wafer along the scribe line region to form a first interposer and a second interposer, wherein each of the plurality of first testing pads is at least partially removed by the sawing of the semiconductive wafer.