Interposer Electrical Testing via Removable Connection Structure
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Solution Overview
Problem
Conventional methods for testing the electrical performance of interposers in 3D-IC packages are inadequate due to the inability to visually inspect voids or crevices in copper posts and the interference of external conductive elements, which hinders the detection of electrical connectivity and performance.
Innovation Solution
A method involving a removable electrical connection structure formed on the surface of the interposer, allowing for the connection of probes to test the conductive through holes without altering the original design, enabling effective electrical testing by forming a circuit with the conductive pads and through holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional wafer testing method is used, then the testing process is simple, but it cannot detect electrical performance due to external conductive elements interference
Solution Approach 1:
The interposer surface is segmented into functional regions: keep pads for electrical connection, test pads for testing, and removable electrical connection structures. This segmentation allows separate handling of testing and functional operations, enabling accurate electrical performance detection without interference from external conductive elements.
Solution Approach 2:
A removable electrical connection structure is introduced as an intermediary element between the test pads and the conductive through holes. This intermediary enables temporary electrical connection during testing, then can be removed to avoid interfering with the final product functionality while maintaining testing capability.
2Measurement precision
If visual inspection is used to detect voids, then the inspection method is simple, but it cannot detect internal voids or crevices in copper posts
Solution Approach 1:
The patent replaces visual/mechanical inspection methods with electrical testing. By measuring electrical conductivity through the conductive through holes, internal voids and crevices in copper posts can be detected indirectly through electrical property changes, achieving deeper inspection capability without complex imaging equipment.
3Measurement precision
If removable electrical connection structure is added for testing, then electrical testing becomes possible, but the interposer structure becomes more complex
Solution Approach 1:
The removable electrical connection structure is designed to be temporary - added during the testing phase and then removed after testing is complete. This allows the interposer to gain testing capability temporarily without permanently increasing structural complexity, as the additional elements are discarded after serving their purpose.
Data Source
AI summary
An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.