Interposer Thermal Conductive Frame for POP Heat Dissipation
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Solution Overview
Problem
The existing package on package (POP) structures face challenges in achieving high density integration and small area installation due to large solder ball diameters and contact pads, leading to suboptimal structural strength, reliability, and inefficient heat dissipation from circuit boards.
Innovation Solution
The proposed solution involves an interposer with an insulating base, electric conductive pillars, and a thermal conductive frame, which includes a top plate and thermal conductive pillars, allowing for improved electrical connectivity and enhanced heat dissipation through thermally conductive materials like copper or silver, integrated with a POP structure to reduce overall thickness and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large diameter solder balls are used to connect two electric elements in a POP structure, then electrical connectivity is achieved, but the volume and area of the POP structure increase significantly
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the two electric elements. The interposer contains conductive pillars that provide electrical connection, replacing the traditional large solder balls. This mediator allows electrical connectivity to be achieved with much smaller connection elements, thereby reducing the overall volume of the POP structure while maintaining reliable electrical connections.
Solution Approach 2:
The patent changes the connection method from using large diameter solder balls to using conductive pillars with diameters significantly smaller than the solder balls. This parameter change in connection element size enables the reduction of POP structure volume while maintaining electrical connectivity functionality.
2Reliability
If large diameter solder balls are used for connection, then electrical connectivity is established, but the structural strength and integrity of the connection deteriorate
Solution Approach 1:
The interposer acts as a mediator that provides mechanically stronger connections through conductive pillars. These pillars are embedded into the electric elements and provide both electrical connectivity and structural strength, overcoming the weakness of traditional solder ball connections.
Solution Approach 2:
The interposer is constructed with composite materials including an insulating base and conductive pillars, creating a structurally strong connection interface. The combination of insulating and conductive materials in the interposer provides both mechanical strength and electrical connectivity, improving upon the single-material solder ball approach.
3Reliability
If two circuit boards are used to insulate the bottom electric element, then electrical insulation is provided, but heat dissipation capability deteriorates
Solution Approach 1:
The interposer serves as a mediator that replaces the insulating circuit boards beneath the bottom electric element. By using the interposer with its thermal conductive frame and pillars, heat dissipation is improved while maintaining the necessary electrical insulation through the insulating base of the interposer structure.
Solution Approach 2:
The patent changes the material properties of the insulating structure from circuit boards with poor thermal conductivity to an interposer with a thermal conductive frame. This parameter change in thermal conductivity enables effective heat dissipation while maintaining electrical insulation functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the structural integrity and reliability of the POP structure while effectively dissipating heat, addressing the limitations of large solder balls and contact pads, and achieving a more compact and efficient design.
Implementation Method 1
a thermal conductive frame 130... The material of the thermal conductive frame 130 is thermally conductive metal such as copper, aluminum, or silver
Implementation Method 2
A plurality of electric conductive pillars 120... The first end face 121 and the first surface 111 are coplanar. The first contact pads 150 are formed on the first surface 111. The first contact pads 150 are electrically connected with the electric conductive pillars 120
Data Source
AI summary
A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.