Interposer Thermal Layout Without Vias for Semiconductor Cooling
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Solution Overview
Problem
Existing thermal management solutions for semiconductor devices, particularly in high-power applications, are inadequate due to limited thermal conductivity and complexity in PCB layout, leading to overheating and reduced reliability.
Innovation Solution
A semiconductor device configuration that eliminates thermal vias and positions high-power components on opposite sides of an interposer, utilizing direct thermal paths and thermally conductive layers for efficient heat dissipation, simplifying PCB layout and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal vias are used for heat dissipation, then thermal pathways are provided, but thermal conductivity is limited and PCB layout complexity increases
Solution Approach 1:
The patent extracts the thermal management function from the PCB structure by using separate thermally conductive layers and heatsinks that are coupled to circuit boards through simplified interfaces. This removes the need for complex thermal via arrangements within the PCB itself, reducing layout complexity while maintaining effective heat dissipation pathways.
Solution Approach 2:
The patent introduces thermally conductive layers as intermediary elements between heat-generating circuits and heatsinks. These layers act as mediators that provide superior thermal conductivity compared to traditional thermal vias, enabling efficient heat transfer without requiring complex PCB internal structures.
2Temperature
If thermal vias are used for heat dissipation, then thermal pathways are provided, but thermal conductivity is insufficient
Solution Approach 1:
The patent employs composite thermal management structures that combine thermally conductive layers (with high thermal conductivity materials) with heatsinks and circuit board substrates. This composite approach creates a multi-material thermal pathway that significantly improves overall thermal conductivity compared to single-material thermal via solutions.
Solution Approach 2:
The thermally conductive layers serve as intermediary elements with superior thermal properties, bridging the gap between heat-generating circuits and external heatsinks. This intermediary layer provides a dedicated high-conductivity pathway that overcomes the thermal conductivity limitations of traditional thermal via structures.
3Productivity
If high-power components are placed on the same side of the PCB, then circuit density is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent utilizes the vertical dimension by implementing thermally conductive layers and heatsinks that extend perpendicular to the circuit board surface. This three-dimensional thermal management approach allows high-power components to be densely packed on the board while heat is efficiently extracted in the vertical direction, resolving the conflict between circuit density and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management, improves device reliability, and allows for more compact and cost-effective designs by directly dissipating heat through separate layers, maintaining optimal operating temperatures and reducing thermal stress.
Implementation Method 1
The second layer is configured to dissipate heat generated by the second circuit
Data Source
AI summary
The subject technology is directed to a semiconductor device. In an embodiment, the semiconductor device comprises an interposer, which comprises a first side and a second side. The first side is opposite the second side. The device further comprises a first circuit coupled to the first side and a second circuit coupled to the second side. The device further comprises a first layer coupled to the first circuit and a second layer coupled to the second circuit. The second layer is configured to dissipate heat generated by the second circuit. This configuration enhances thermal management by providing a direct thermal path for heat dissipation, improving the overall efficiency and reliability of the semiconductor device. Additionally, the elimination of thermal vias simplifies the PCB layout, allowing for more compact and cost-effective designs.