Interposer Thermal Structure for Semiconductor Package Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges in thermal radiation and reliability due to increased power consumption and heat generation, particularly in high-speed and high-capacity applications, where existing thermal management solutions struggle to efficiently dissipate heat and prevent electrical shorts during mounting processes.
Innovation Solution
A semiconductor package design incorporating an interposer substrate with penetrating holes, a thermal radiation structure featuring a supporter and protrusions, and a thermal conductive layer between the thermal radiation structure and the semiconductor chip, which enhances thermal dissipation and prevents electrical shorts by allowing heat to be discharged directly from the chip without traveling to the upper package, while maintaining compact size and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal radiation structure is added to improve heat dissipation, then thermal radiation characteristics are improved, but device complexity increases
Solution Approach 1:
The thermal radiation structure is nested within the interposer substrate by forming protrusions inside pre-existing holes that penetrate through the interposer substrate. This nesting approach allows the thermal radiation structure to be integrated into the existing package architecture without adding external components, thereby improving thermal radiation characteristics while minimizing increases in device complexity
Solution Approach 2:
The interposer substrate serves multiple functions: it provides mechanical support, enables electrical connections through vias, and houses the thermal radiation structure through its holes. By making the interposer substrate multi-functional, the patent avoids adding separate dedicated thermal management components, thus improving thermal radiation without proportionally increasing device complexity
2Loss of energy
If thermal conductive layer is added between chip and thermal radiation structure, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The thermal conductive layer is formed in the holes of the interposer substrate before the thermal radiation structure protrusions are inserted. This preliminary action allows the thermal conductive material to be properly positioned and bonded to both the semiconductor chip and the protrusions, ensuring efficient heat transfer while simplifying the overall manufacturing process by establishing thermal pathways early in the fabrication sequence
3Temperature
If holes are formed in interposer substrate for thermal radiation structure, then thermal dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The thermal radiation structure is segmented into multiple protrusions distributed across multiple holes in the interposer substrate. This segmentation allows the thermal management function to be achieved through many small, precisely-formed holes rather than requiring a single large hole or complex continuous structure, thereby improving thermal dissipation while making the manufacturing precision requirements more manageable through standard fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves thermal radiation characteristics and reliability by promptly discharging heat from the semiconductor chip, preventing electrical shorts, and allowing for easier handling of the interposer substrate during fabrication, thereby enhancing the overall performance and durability of the semiconductor package.
Implementation Method 1
a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure
Implementation Method 2
a thermal radiation structure that includes a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate
Data Source
AI summary
Provided is a semiconductor package comprising a lower package that includes a lower substrate and a lower semiconductor chip, an interposer substrate on the lower package and having a plurality of holes that penetrate the interposer substrate, a thermal radiation structure that includes a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate, and a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure.