Interposer Thickness Compensation in 3D Stacked Package Assembly
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Solution Overview
Problem
In 3D stacking modules, the total thickness variation (TTV) of substrates and interposers can lead to improper connection between upper and lower substrates due to large electrical connections and interposers, causing connectivity issues.
Innovation Solution
The implementation of a semiconductor device package with a main carrier, interposer, and sub-carrier, where the interposer has varying thicknesses and electrical connections of different volumes and spacings to compensate for thickness differences, ensuring proper connection and reducing TTV to less than 10 μm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the interposer has uniform thickness to simplify manufacturing, then manufacturing precision is improved, but the ability to compensate for TTV differences between substrates deteriorates
Solution Approach 1:
The interposer is designed with non-uniform thickness, having a first thickness at a first location and a second thickness at a second location. This local variation in thickness allows the interposer to compensate for TTV differences between substrates while maintaining manufacturing feasibility through controlled thickness variation at specific locations.
2Reliability
If the electrical connections are made larger to improve electrical performance, then electrical conductivity is improved, but the total thickness variation of the assembly worsens
Solution Approach 1:
The electrical connections are designed with different volumes and spacing configurations to compensate for thickness differences. By varying the volume and spatial arrangement of electrical connections rather than uniformly increasing size, the design achieves reliable electrical performance while controlling total thickness variation within 10 μm.
3Area of stationary object
If the electrical connections are spaced closer together to reduce area, then area is reduced, but the compensation capability for thickness differences deteriorates
Solution Approach 1:
The electrical connections are arranged with asymmetric spacing, where the distance between electrical connections varies at different locations. This asymmetric spacing pattern allows the interposer to compensate for thickness differences while maintaining a compact overall area, achieving both space efficiency and adaptability.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first carrier having a first surface, an interposer disposed over the first surface of the first carrier, wherein the interposer has a first thickness and a second thickness in a direction substantially perpendicular to the first surface of the first carrier; and a plurality of electrical connections between the first carrier and the interposer and configured to compensate a difference between the first thickness and the second thickness of the interposer.