Interposer with Through Vias for Chip Interconnect
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Solution Overview
Problem
The miniaturization of consumer electronic devices leads to increased difficulty and complexity in wiring between chips due to reduced distances, resulting in electromagnetic interference.
Innovation Solution
An interposer with a connective substrate and through vias is used to electrically connect multiple chips, reducing the package size and area by facilitating signal transmission between flip-chip components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the distance between chips is reduced to decrease package area, then the area of the package is reduced, but the wiring difficulty and electromagnetic interference increase
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between multiple chips. The interposer provides a centralized connection point with multiple contact pads that can be wirelessly connected to chips, eliminating the need for direct complex wiring between closely spaced chips. This mediator structure simplifies the wiring architecture while enabling compact chip arrangement.
2Area of stationary object
If the distance between chips is reduced to decrease package area, then the area of the package is reduced, but electromagnetic interference between chips increases
Solution Approach 1:
The interposer substrate acts as an electromagnetic shielding intermediary, physically separating the signal paths between chips. By routing connections through the interposer rather than directly between chips, the structure reduces electromagnetic coupling and interference while maintaining compact form factor.
3Reliability
If conventional wiring methods are used between closely spaced chips, then signal transmission is achieved, but the wiring process becomes difficult and complex
Solution Approach 1:
The connection architecture is segmented into two independent stages: (1) chip-to-interposer connections using simplified wire bonds, and (2) interposer-to-chip connections on the other side. This segmentation transforms a single complex wiring task into two simpler, more manageable wiring tasks that can be performed with standard processes.
Data Source
AI summary
The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.