Interposer Thermal Layout for Via-Free Semiconductor Cooling
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Solution Overview
Problem
Existing thermal management solutions for semiconductor devices, particularly in high-power applications, are inadequate due to limited thermal conductivity and complex PCB layouts, leading to overheating and reduced reliability.
Innovation Solution
The implementation of a semiconductor device configuration that eliminates thermal vias and positions high-power components on opposite sides of an interposer, utilizing direct thermal paths and thermally conductive layers for efficient heat dissipation, thereby simplifying the PCB layout and enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal vias are used for heat dissipation, then thermal pathways are provided, but thermal conductivity is limited and PCB layout complexity increases
Solution Approach 1:
The patent transitions from planar thermal management (thermal vias on PCB) to three-dimensional thermal management by placing high-power components on opposite sides of an interposer, enabling direct thermal pathways through the interposer thickness dimension. This dimensional change eliminates the need for complex thermal via routing while providing efficient heat dissipation.
Solution Approach 2:
The patent extracts the thermal management function from the PCB layer and relocates it to the interposer structure. By positioning components on opposite sides of the interposer and utilizing the interposer's thermal conductivity, the design removes the dependency on thermal vias and their associated layout complexities.
2Temperature
If thermal vias are used for heat dissipation, then thermal pathways are provided, but thermal resistance remains high
Solution Approach 1:
The patent creates direct thermal pathways by utilizing the vertical dimension through the interposer. Heat flows directly from high-power components on one side through the interposer to heat sinks or passive components on the opposite side, eliminating the high thermal resistance associated with lateral thermal via pathways.
3Ease of manufacture
If high-power components are positioned on the same side, then PCB layout is simplified, but thermal management efficiency decreases
Solution Approach 1:
The patent resolves the conflict between layout simplicity and thermal efficiency by utilizing the third dimension (interposer thickness). High-power components are positioned on opposite sides of the interposer, creating direct thermal pathways through the interposer while maintaining manufacturing simplicity.
4Ease of manufacture
If thermal vias are eliminated, then PCB layout is simplified and manufacturing is easier, but thermal pathways must be reconfigured
Solution Approach 1:
The patent extracts the thermal pathway function from the PCB's thermal via system and relocates it to the interposer structure. By positioning components on opposite sides of the interposer and utilizing the interposer's thermal conductivity, the design eliminates thermal vias while maintaining effective heat dissipation pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal efficiency and reliability by reducing thermal resistance, maintaining optimal operating temperatures, and simplifying manufacturing, while allowing for more compact and cost-effective designs.
Implementation Method 1
a second layer coupled to the second circuit. The second layer is configured to dissipate heat generated by the second circuit
Data Source
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AI summary
The subject technology is directed to a semiconductor device. In an embodiment, the semiconductor device comprises an interposer, which comprises a first side and a second side. The first side is opposite the second side. The device further comprises a first circuit coupled to the first side and a second circuit coupled to the second side. The device further comprises a first layer coupled to the first circuit and a second layer coupled to the second circuit. The second layer is configured to dissipate heat generated by the second circuit. This configuration enhances thermal management by providing a direct thermal path for heat dissipation, improving the overall efficiency and reliability of the semiconductor device. Additionally, the elimination of thermal vias simplifies the PCB layout, allowing for more compact and cost-effective designs.