Interposer Via Opening Structure to Reduce Package Warpage
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Solution Overview
Problem
The existing semiconductor packages face challenges in reliability due to warpage issues caused by the thickness of interposer substrates, leading to non-wettability and short defects, and the process of forming connection pads is costly and complex.
Innovation Solution
A semiconductor package design that includes an interposer substrate with a passivation layer having inclined side surfaces on its openings, allowing conductive pillars to directly connect through these openings without a connection pad, thereby controlling warpage and reducing process costs by omitting the need for connection pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer substrate with conventional flat openings is used, then connection pads can be formed to ensure good electrical connection, but the manufacturing process becomes costly and complex
Solution Approach 1:
The invention extracts and eliminates the connection pad structure from the conventional semiconductor package. By removing the connection pad layer and process steps, the design achieves direct electrical connection through the conductive pillar to the through via, simplifying the manufacturing process while maintaining electrical connection reliability
Solution Approach 2:
Instead of forming flat openings and adding connection pads on top, the invention inverts the approach by creating inclined openings that directly expose the through via. The conductive pillar is formed to extend through these inclined openings, reversing the conventional sequence of forming connections and eliminating the need for separate connection pad structures
2Reliability
If an interposer substrate with conventional flat openings is used, then connection pads can be formed to ensure good electrical connection, but manufacturing costs increase
Solution Approach 1:
The invention extracts and eliminates the connection pad structure from the conventional semiconductor package. By removing the connection pad layer and process steps, the design achieves direct electrical connection through the conductive pillar to the through via, simplifying the manufacturing process while maintaining electrical connection reliability
Solution Approach 2:
The invention uses a simpler, more cost-effective structure by eliminating the need for expensive connection pad materials and multi-layer processing. The inclined opening design with direct conductive pillar formation reduces material costs and manufacturing complexity, achieving reliable electrical connection through a more economical approach
3Adaptability or versatility
If a thick interposer substrate is used to support multiple semiconductor chips, then chip mounting capacity increases, but warpage occurs leading to non-wettability and short defects
Solution Approach 1:
The invention introduces asymmetry in the opening structure by creating inclined side surfaces instead of flat horizontal surfaces. This asymmetric inclined design allows the conductive pillar to make contact with both the through via and the inclined wall, providing mechanical anchoring that compensates for warpage effects and improves wetting reliability in thick interposer substrates
Solution Approach 2:
The inclined openings create a curved or angled contact surface between the conductive pillar and the interposer substrate structure. This curved interface improves the mechanical interlocking and electrical connection reliability, allowing the thick interposer to maintain structural integrity and electrical performance despite warpage tendencies
Data Source
AI summary
A semiconductor package includes a base substrate and an interposer substrate. The interposer substrate includes a semiconductor substrate, a first passivation layer, a wiring region, a through via penetrating through the semiconductor substrate and the first passivation layer, and a second passivation layer covering at least a portion of the first passivation layer and having an opening exposing a lower surface of the through via. The semiconductor package further includes a conductive pillar extending from the opening of the second passivation layer; and a conductive bump disposed between the conductive pillar and the base substrate. The opening of the second passivation layer has inclined side surfaces such that a width of the opening decreases towards the first passivation layer, and side surfaces of the conductive pillar are positioned to overlap the inclined side surfaces of the second passivation layer in a vertical direction.