Interposer Structure Layout for Void-Free, Low-Warpage Packaging
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Solution Overview
Problem
The miniaturization of semiconductor devices has made packaging increasingly difficult, leading to challenges in yield and reliability due to void formation and warpage issues in semiconductor packages.
Innovation Solution
A semiconductor package structure with an interposer structure that includes an insulating base and island layers to facilitate encapsulating material flow, and dummy through-vias to enhance rigidity, preventing voids and warpage, thereby improving package reliability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If device sizes continue to decrease, then productivity and integration are improved, but manufacturing precision and packaging difficulty worsen
Solution Approach 1:
The patent introduces an interposer structure as an intermediary component between the substrate and the die. This interposer includes an insulating base with a first surface and a second surface, where the first surface contacts the substrate and the second surface contacts the die. The interposer structure mediates the packaging process, providing a stable platform that improves manufacturing precision while enabling continued device miniaturization and integration.
2Productivity
If conventional packaging technology is used, then known-good-dies can be packaged, but void formation and warpage occur leading to reduced reliability
Solution Approach 1:
The patent applies local quality by creating a recess in the insulating base of the interposer structure. This recess is specifically positioned and dimensioned to control the flow of encapsulating material during the packaging process. By modifying only the local geometry of the insulating base (creating the recess) rather than changing the entire structure, the patent ensures proper material distribution, prevents void formation, and reduces warpage, thereby improving package reliability while maintaining packaging efficiency.
3Productivity
If device miniaturization continues, then productivity improves, but packaging difficulty increases leading to yield loss
Solution Approach 1:
The interposer structure serves as a mediator that simplifies the packaging process for miniaturized devices. By providing a stable, controllable platform with a specifically designed recess structure, the interposer makes it easier to handle and package small devices without increasing yield loss, thus improving ease of manufacture despite continued device miniaturization.
4Ease of manufacture
If encapsulating material is filled in conventional manner, then packaging is completed, but voids form reducing reliability
Solution Approach 1:
The recess in the insulating base creates a localized feature that guides encapsulating material flow. This local geometric modification ensures that material flows properly into the packaging structure without trapping voids, while maintaining the overall simplicity of the packaging process. The recess acts as a flow channel that improves reliability without significantly complicating the manufacturing process.
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulting features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulting features are arranged in a matrix and face a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the plurality of insulting features.