Interposer Warpage Prevention in Semiconductor Packages
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Solution Overview
Problem
The increasing demands for higher performance, faster speed, and miniaturization in the electronic industry pose challenges in maintaining the stability and reliability of semiconductor packages, particularly in preventing warpage during the stacking and connection of semiconductor chips.
Innovation Solution
A semiconductor package design incorporating an interposer for electrical connection between upper and lower packages, utilizing a combination of solder balls and an adhesive layer to manage warpage, where the interposer's restitution force helps in reducing or preventing warpage by modifying the package structure to a convex form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multiple semiconductor chips are stacked and connected using conventional methods, then higher performance and faster speed operation are achieved, but warpage occurs during the stacking and connection process
Solution Approach 1:
An interposer is introduced as an intermediary component between the first semiconductor chip and the second semiconductor chip. The interposer facilitates electrical connection through solder balls while its convex shape provides structural support to prevent warpage of the stacked packages, thus enabling high-speed operation without compromising package stability.
Solution Approach 2:
The interposer is designed with a convex shape that protrudes from the first semiconductor chip. This curved geometry distributes mechanical stress and provides structural reinforcement to counteract warpage forces generated during stacking, allowing stable connection of multiple high-performance chips.
2Volume of moving object
If semiconductor chips are stacked in POP type configuration, then miniaturization is achieved, but warpage and reliability issues occur
Solution Approach 1:
The interposer serves as a mediator that enables compact POP configuration while ensuring reliable electrical and mechanical connection. Its convex structure provides the necessary support to prevent warpage, thus maintaining package reliability in the miniaturized stacked configuration.
Solution Approach 2:
The package structure combines multiple materials including the interposer material, solder balls, adhesive layers, and semiconductor chip materials. This composite structure leverages the complementary properties of each material to achieve both miniaturization and enhanced reliability through warpage prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of semiconductor packages by effectively reducing or preventing warpage, ensuring stable electrical connections and maintaining performance standards.
Implementation Method 1
an adhesive layer between the first semiconductor chip and the interposer
Implementation Method 2
a first group of at least one solder ball on a side surface of the first semiconductor chip and configured to electrically connect the first substrate and the interposer
Implementation Method 3
enhanced with reliability by using restitution force of an interposer for reducing or preventing warpage
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a first substrate, a first semiconductor chip arranged on the first substrate, a first group of at least one solder ball arranged on a side surface of the first semiconductor chip, an interposer arranged on the first semiconductor chip and the first substrate and being in contact with the first group of at least one solder ball, and an adhesive layer arranged between the first semiconductor chip and the interposer and configured to expose at least a portion of un upper surface of the first semiconductor chip, wherein a first height from an upper surface of the first substrate to the upper surface of the first semiconductor chip is greater than a second height of the first group of at least one solder ball.