Interposer Warpage Prevention Structure for Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages face challenges in reducing warpage and enhancing thermal characteristics, particularly as they become smaller and more complex.
Innovation Solution
The semiconductor package incorporates a warpage prevention structure on the interposer's first surface, positioned between semiconductor devices, which helps to mitigate thermal expansion mismatches and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If semiconductor packages are made smaller and lighter to meet user demands, then portability and compactness are improved, but warpage control and thermal management become more difficult
Solution Approach 1:
The patent applies local quality by positioning warpage prevention structures (such as reinforcement patterns or additional substrate layers) at specific high-stress regions of the package, rather than uniformly throughout. This allows targeted reinforcement where thermal expansion and mechanical stress are most problematic, maintaining overall package lightness while improving warpage control in critical areas.
Solution Approach 2:
The patent employs composite materials by combining different substrate materials with varying thermal expansion coefficients and mechanical properties. This multi-material approach allows the package to achieve both reduced weight and improved warpage resistance by selecting materials that complement each other's thermal and mechanical characteristics.
2Quantity of substance
If multiple semiconductor devices are stacked on an interposer substrate, then device capacity and integration density are improved, but thermal expansion mismatches and warpage increase
Solution Approach 1:
The patent applies parameter changes by modifying the physical and thermal parameters of the interposer substrate, including its thickness, material composition, and thermal expansion coefficient. These parameter adjustments are optimized to accommodate multiple stacked devices while compensating for thermal expansion mismatches that would otherwise cause warpage and structural instability.
Solution Approach 2:
The patent uses segmentation by dividing the interposer substrate into multiple layers or sections with different material properties. This layered structure allows each segment to handle specific thermal and mechanical stresses independently, preventing cumulative warpage effects from multiple stacked devices while maintaining high integration density.
3Stability of the object's composition
If warpage prevention structures are added to the interposer, then structural stability is improved, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating warpage prevention structures directly into the interposer substrate fabrication process, rather than adding them as separate post-processing components. The reinforcement patterns are combined with the substrate material deposition and patterning steps, achieving structural stability without significantly increasing manufacturing complexity or device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces warpage and enhances thermal characteristics by managing thermal expansion differences between the interposer and packaging materials, thereby improving the reliability and performance of semiconductor packages.
Implementation Method 1
which helps to mitigate thermal expansion mismatches and reduce warpage
Data Source
AI summary
A semiconductor package includes a package substrate, an interposer disposed on the package substrate, the interposer including a first surface and a second surface opposite to the first surface, a first semiconductor device mounted on the second surface of the interposer, a second semiconductor device disposed on the second surface and spaced apart from the first semiconductor device in a first horizontal direction that is parallel to the second surface, and a warpage prevention structure disposed on the first surface of the interposer at a position on the first surface that corresponds to a position between the first semiconductor device and the second semiconductor device on the second surface of the interposer and that vertically overlaps the first semiconductor device and the second semiconductor device.