Interposer Warping Reduction via Symmetric Insulating Layers
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Solution Overview
Problem
Conventional interposers face challenges in mounting electronic components with narrow-pitched wiring patterns due to warping issues, especially when using multi-layered structures with different layered configurations on the upper and lower sides of the silicon substrate.
Innovation Solution
An interposer design featuring a wiring member and a reinforcement member with symmetrically arranged inorganic and organic insulating layers, where the reinforcement member is adhered to the wiring member using an adhesive, allowing both to warp in opposite directions and reducing overall warping, thereby enabling the mounting of components with high-density wiring patterns without narrow-pitched through-wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If multi-layered wiring structures are used to miniaturize wiring patterns, then wiring pitch is reduced, but warping of the interposer occurs
Solution Approach 1:
The patent applies asymmetry by making the reinforcement member have a frame-like structure with an opening portion rather than a solid symmetric structure. This asymmetric design with the opening portion allows for stress relief and reduces warping while maintaining the multi-layered wiring structure for miniaturized wiring patterns.
Solution Approach 2:
The reinforcement member is segmented into a frame-like structure with an opening portion rather than being a continuous solid structure. This segmentation reduces the overall stiffness of the reinforcement member, allowing it to accommodate thermal expansion differences and reduce warping of the interposer while still providing structural support for the multi-layered wiring patterns.
2Productivity
If different layered structures are provided on upper and lower sides of silicon substrate, then wiring density is improved, but warping occurs
Solution Approach 1:
The patent applies local quality by providing different layered structures at different locations: the upper side has multiple inorganic insulating layers and wiring layers for high wiring density, while the lower side has a reinforcement member with an opening portion for warping control. This localized differentiation allows each side to perform its specific function optimally.
Solution Approach 2:
The interposer uses composite materials with different properties on each side: the upper side uses multiple inorganic insulating layers (silicon oxide, silicon nitride) for high-density wiring, while the lower side uses a frame-like reinforcement structure with opening portions. This composite structure allows the upper side to achieve high wiring density while the lower side controls warping through its open framework design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces warping, improves the reliability of electronic component mounting, and allows for high-density wiring patterns on the interposer, enhancing the connection between the interposer and electronic components.
Implementation Method 1
an adhesive part interposed between the wiring member and the reinforcement member
Data Source
AI summary
An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer.