Interposer Coaxial-to-Waveguide Layout for Compact Millimeter-Wave Coupling
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Solution Overview
Problem
The integration of millimeter-wave launchers and antenna structures within miniaturized integrated circuits increases package size and introduces geometric constraints, limiting the flexibility and efficiency of component placement in larger systems.
Innovation Solution
The use of an interposer circuit board with a coaxial transition structure and waveguide structure, where the coaxial transition is formed by a via surrounded by additional vias, and the waveguide structure extends vertically with an aperture at its end, allowing millimeter-wave energy to be directed to the waveguide aperture, facilitating signal coupling without obstructing conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If millimeter-wave launchers and antenna structures are integrated within miniaturized integrated circuits, then signal coupling capability is improved, but package size increases and geometric constraints are introduced
Solution Approach 1:
The patent transitions from planar two-dimensional circuit board layouts to three-dimensional vertical structures by extending waveguides vertically through multiple layers of the interposer substrate. This dimensional change allows millimeter-wave signals to propagate in the vertical direction, enabling compact integration while maintaining effective signal coupling capability.
Solution Approach 2:
The patent implements nested structures where waveguide cavities are formed within the interposer substrate, and additional circuit boards are bonded within or around these waveguide structures. This nesting approach allows multiple functional components to occupy overlapping spatial volumes, reducing the overall package size while maintaining signal coupling effectiveness.
2Reliability
If millimeter-wave launchers and antenna structures are integrated within miniaturized integrated circuits, then signal coupling capability is improved, but flexibility in component placement is reduced
Solution Approach 1:
The interposer substrate serves multiple functions simultaneously: it provides mechanical support for bonding additional circuit boards, forms three-dimensional waveguide structures for signal transmission, and enables flexible component placement through its layered architecture. This multi-functionality allows the same structure to accommodate various component configurations while maintaining signal coupling capability.
Solution Approach 2:
The patent creates a dynamic, modular architecture where additional circuit boards can be bonded to different surfaces of the interposer at various positions. This modular approach allows flexible component placement and system configuration while maintaining effective millimeter-wave signal coupling through the waveguide structures.
3Ease of manufacture
If conventional circuit board layouts are used, then manufacturing simplicity is maintained, but millimeter-wave signal coupling efficiency is reduced
Solution Approach 1:
The patent segments the millimeter-wave signal path into distinct functional sections: feed contacts on the interposer, vertical waveguide structures extending through substrate layers, and aperture couplings to external antennas. This segmentation allows each section to be optimized for its specific function while maintaining overall manufacturing simplicity through standardized interposer fabrication processes.
Solution Approach 2:
The interposer acts as an intermediary structure that bridges conventional circuit board manufacturing techniques and advanced millimeter-wave signal coupling requirements. It provides standardized bonding surfaces for conventional PCB processes while incorporating three-dimensional waveguide structures that enable efficient millimeter-wave signal transmission, thus mediating between manufacturing simplicity and signal coupling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces package size, enhances flexibility in component placement, and maintains compatibility with conventional circuit board layouts, enabling efficient coupling of millimeter-wave signals to external antenna structures.
Implementation Method 1
The coaxial transition structure and the waveguide structure are jointly configured and arranged to direct millimeter-wave energy delivered to the feed contact to the aperture in the waveguide structure
Data Source
AI summary
A circuit-board interposer includes contacts on a top surface and a bottom surface and includes a millimeter-wave coaxial transition structure formed using contacts on the top surface and vias extending into the interposer. A first via extends into the interposer to a first depth and is surrounded by additional vias that penetrate the interposer to a second depth smaller than the first depth. The interposer also includes a hollow conductive waveguide structure formed within the interposer that extends from the second depth to a third depth that has a first end and a second end. The first via extends into the waveguide at the first end and an aperture is present at the second end. The coaxial transition and the waveguide together are configured to couple millimeter-wave energy from a feed contact on the top surface of the interposer and direct it to the aperture.