Interposer Package Structure for Wireless IC Thermal and EMI Management

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Solution Overview

Problem

Conventional IC packaging technologies face challenges with poor thermal dissipation and electromagnetic interference (EMI) protection, and they often cannot accommodate on-package wireless communication elements like antennas and inductors, leading to increased costs and performance compromises.

Innovation Solution

The use of an interposer package structure that integrates wireless communication elements, such as beam-forming antenna arrays, inductors, and thermally conductive materials, along with EMI shielding, to facilitate high-speed signaling and improve thermal management within the IC package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional IC packaging (OMPAC or die down) is used, then manufacturing cost is reduced or design flexibility is improved, but thermal dissipation performance deteriorates and EMI protection is insufficient

Engineering Contradiction:

Improvethermal dissipationVSAvoidpackaging structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into a single interposer substrate: wireless communication elements (antennas, inductors), thermal management (thermally conductive material), and EMI shielding are all integrated into one component that sits between the IC die and the circuit board. This consolidation resolves the contradiction by achieving superior thermal dissipation and EMI protection without proportionally increasing packaging complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The interposer substrate serves multiple functions simultaneously: it provides electrical interconnection, thermal conduction path, EMI shielding, and houses wireless communication elements. This multi-functionality allows the packaging structure to achieve superior thermal and EMI performance without requiring separate dedicated components for each function, thus managing complexity effectively.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If conventional IC packaging is used, then device simplicity is maintained, but the ability to integrate wireless communication elements is lost

Engineering Contradiction:

Improveintegration of wireless communication elementsVSAvoidpackaging structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent transitions from planar integration to three-dimensional vertical integration by placing wireless communication elements, thermally conductive material, and EMI shielding layers in stacked configurations within the interposer. This dimensional change enables high integration of multiple functions while maintaining a compact form factor, resolving the contradiction between versatility and complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If die down IC package configuration with antenna on substrate is used, then wireless communication capability is achieved, but design cost and complexity increase

Engineering Contradiction:

Improvewireless communication capabilityVSAvoiddesign cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent segments the wireless communication functionality from the main IC die and places it on a separate interposer substrate. This segmentation allows independent optimization and manufacturing of the wireless elements, reducing overall design cost and complexity while maintaining wireless communication capability.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal dissipation and EMI protection, allowing for improved performance and reduced costs by integrating wireless communication elements and thermally conductive materials directly within the IC package, thereby addressing the limitations of conventional packaging technologies.

Implementation Method 1

an interposer package structure for wireless communication, according to embodiments of the present invention

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

EMI shielding, to facilitate high-speed signaling and improve thermal management within the IC package

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS9230875B2Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding

Publication Date: 2016.01.05 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.