Semiconductor Packaging Interposer Wiring Bus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in providing power, electrical ground, and signals to multiple semiconductor dies due to limited access to inner bond fingers, often resulting in insufficient connections and physical blockages.
Innovation Solution
Incorporating an interposer that acts as a bridge between semiconductor dies and inner bond fingers, allowing indirect access and reducing the number of inner bond fingers needed for connections, thereby ensuring full access to power, ground, and signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple semiconductor dies are combined and connected using gold wiring with direct inner bond finger access, then electrical connections are established, but access to inner bond fingers is limited due to physical limitations or interconnection process limitations
Solution Approach 1:
An interposer is introduced as an intermediary component between the semiconductor dies and the inner bond fingers. The interposer provides alternative wiring paths that bypass physical blockages, enabling electrical connections to inner bond fingers that would otherwise be inaccessible due to the positioning and orientation of multiple semiconductor dies in the package.
2Device complexity
If the count of inner bond fingers is reduced, then device complexity is reduced, but access to power and signals for multiple semiconductor dies becomes insufficient
Solution Approach 1:
The interconnection function is segmented between the interposer and the inner bond fingers. The interposer handles the complex routing and distribution of power and signals to multiple semiconductor dies through its internal wiring structure, while the inner bond fingers serve as simplified connection points to the package external pins, reducing their required count.
Solution Approach 2:
The interposer introduces an additional dimensional layer in the interconnection architecture. Instead of direct lateral connections from semiconductor dies to inner bond fingers, the interposer provides vertical and lateral routing paths within its substrate, enabling access to inner bond fingers through a different spatial dimension that bypasses physical blockages.
Data Source
AI summary
A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.