Interposer Wraparound Molding for Crack-Resistant Semiconductor Packages
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Solution Overview
Problem
The packaging materials and arrangements in multi-die semiconductor packages affect the reliability of the packaged products, necessitating improved methods to enhance structural integrity and reduce cracking and delamination risks.
Innovation Solution
A semiconductor package design that includes an interposer with semiconductor dies bonded to a redistribution structure, encapsulated by a molding compound that laterally wraps around the interposer and covers its sidewalls, and connected via connectors, ensuring robust electrical connections and enhanced structural protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging materials and arrangements are used in multi-die packages, then manufacturing simplicity is maintained, but reliability and structural integrity deteriorate due to cracking and delamination risks
Solution Approach 1:
The patent divides the packaging structure into distinct functional layers: a first packaging material layer positioned at peripheral regions, a second packaging material layer positioned at central regions, and an underfill material layer. This segmentation allows each material to be optimized for its specific function, with the first packaging material providing structural support and crack prevention at stress-prone peripheral areas, while the second packaging material provides protection in central regions.
Solution Approach 2:
Different packaging materials are selectively applied to different regions of the semiconductor package based on local stress and functional requirements. The first packaging material with higher structural integrity is placed at peripheral regions where cracking and delamination are most likely to occur, while the second packaging material is used in central regions. This local quality approach ensures that each area receives the appropriate level and type of protection.
2Strength
If packaging materials are arranged to improve reliability, then cracking and delamination risks are reduced, but manufacturing complexity increases
Solution Approach 1:
The first packaging material layer is applied to peripheral regions before the second packaging material layer is applied to central regions. This preliminary action ensures that the structural support framework is established first, creating a stable base that prevents cracking and delamination during subsequent manufacturing steps. The underfill material is also applied in a predetermined sequence to ensure proper wetting and adhesion.
Solution Approach 2:
The underfill material serves as an intermediary layer between the semiconductor dies and the packaging materials, providing adhesion and stress distribution. This intermediary layer facilitates the bonding between different components and reduces the risk of delamination, making the overall manufacturing process more reliable despite the increased material complexity.
3Object-affected harmful factors
If a single packaging material is used, then manufacturing simplicity is maintained, but protection against cracking and delamination is insufficient
Solution Approach 1:
The packaging structure is segmented into multiple material layers with distinct functions. The first packaging material layer is specifically designed to prevent cracking and delamination at peripheral regions, while the second packaging material layer provides protection in central regions. This segmentation allows each material to be optimized for its specific protective function.
Solution Approach 2:
The patent employs a composite packaging structure combining different materials with complementary properties. The first packaging material is selected for its high structural integrity and crack resistance, while the second packaging material provides additional protection and flexibility. This composite approach creates a synergistic effect where the combination of materials provides superior protection against cracking and delamination compared to any single material alone.
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.