Interposing PCB Layout for Low-Loss 5G Antenna Feeding
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Solution Overview
Problem
Existing antenna structures in wireless communication systems face challenges in reducing signal transmission loss and burden on radio unit (RU) boards, particularly with increasing numbers of antennas, leading to increased design complexity and cost.
Innovation Solution
The introduction of an interposing board that separates RF lines from the main PCB, providing vertical connections between antenna elements and RFICs, minimizing transmission length and using high-density interconnection methods to reduce transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If antenna elements are directly connected to RFICs on the same PCB, then device complexity is reduced, but signal transmission loss increases due to long transmission lines
Solution Approach 1:
The patent divides the PCB into two separate boards: an antenna board for mounting antenna elements and an RF board for mounting RFICs. This segmentation allows each board to be optimized independently, reducing signal transmission loss by minimizing the length of transmission lines on the antenna board while keeping the RF processing functions on a separate RF board.
Solution Approach 2:
The patent introduces an interposing board that acts as an intermediary between the antenna board and RF board. This interposing board provides vertical connection paths through grid arrays, enabling short transmission lines for signal transmission while managing the complexity of inter-board connections through standardized interfaces.
2Loss of energy
If multiple antenna elements are integrated on a single PCB, then device complexity is reduced, but transmission loss increases due to increased transmission line length
Solution Approach 1:
The patent segments the antenna elements from the RF processing circuitry by placing them on separate boards. This allows multiple antenna elements to be mounted on the antenna board with short transmission lines to the interposing board, avoiding the need for long transmission lines that would be required if all elements were integrated on a single large PCB.
Solution Approach 2:
The patent transitions from a planar integration approach to a three-dimensional stacked architecture using multiple PCBs connected vertically. This dimensional change allows short transmission lines in the vertical direction through the interposing board while accommodating multiple antenna elements on the antenna board, effectively reducing transmission loss without increasing device complexity.
3Loss of energy
If antenna elements are separated from RFICs onto different PCBs, then transmission loss is reduced, but device complexity increases
Solution Approach 1:
The interposing board serves as a mediator that manages the complexity of connections between the antenna board and RF board. It provides standardized grid array interfaces and vertical connection paths, simplifying the inter-board connectivity while enabling the separation of antenna elements from RFICs to reduce transmission loss.
Solution Approach 2:
The interposing board performs multiple functions: it provides vertical connection paths for signal transmission, manages power distribution, and facilitates heat dissipation. This multi-functionality consolidates several complex tasks into a single component, reducing overall device complexity while enabling the beneficial separation of antenna elements from RFICs.
Data Source
AI summary
A 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE) is provided. The radio unit (RU) device includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed, a second PCB on which a radio frequency integrated circuit (RFIC) is disposed, and a third PCB configured to electrically connect each of the plurality of antenna elements and the RFIC between the first PCB and the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.