Intersecting Airflow Cooling Device for Liquid Crystal Projectors
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Solution Overview
Problem
Existing cooling devices for liquid crystal projectors face limitations in improving the heat transfer coefficient, leading to inefficient heat dissipation due to a thick boundary layer, and increasing fan speed or size results in noise or contradicts miniaturization efforts.
Innovation Solution
A cooling device design featuring air flows from first and second openings intersecting over the heat discharge surface, generating a collision jet with a swirl flow that thins the boundary layer, enhancing the heat transfer coefficient by directing airflow perpendicular to the surface and moving the collision jet to improve cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling is used with parallel airflow, then the cooling device structure is simple, but the heat transfer coefficient is low due to thick boundary layer
Solution Approach 1:
The cooling device divides the airflow generation into multiple independent components (first and second air cooling parts with separate openings and fans), allowing each to generate airflow in a specific direction. This segmentation enables the creation of intersecting airflow patterns that collide to thin the boundary layer, significantly improving the heat transfer coefficient while maintaining manageable device complexity through modular design
Solution Approach 2:
The invention transitions from traditional single-direction parallel airflow to multi-directional intersecting airflow. By positioning openings and fans to generate airflow from different directions that intersect over the heat discharge surface, the system creates a three-dimensional airflow pattern that actively collides to thin the boundary layer, transforming the cooling mechanism from two-dimensional parallel flow to three-dimensional intersecting flow for enhanced heat transfer
2Temperature
If fan speed is increased to improve cooling efficiency, then the heat dissipation improves, but the noise increases
Solution Approach 1:
The cooling system segments the airflow generation task across multiple fans operating at lower speeds rather than one high-speed fan. Each fan generates airflow in a specific direction, and their combined effect creates the intersecting collision flow pattern. This segmentation allows the system to achieve high cooling efficiency through flow pattern optimization rather than increasing individual fan speeds, thereby reducing noise
Solution Approach 2:
The invention changes the flow direction parameters and intersection angle of the airflow rather than increasing flow speed parameters. By optimizing the geometric parameters of airflow intersection and collision angle, the system achieves enhanced boundary layer thinning and heat transfer coefficient improvement without relying on high fan speeds, thus maintaining low noise operation while improving heat dissipation efficiency
3Temperature
If fan size is increased to improve cooling efficiency, then the heat dissipation improves, but the device size increases contradicting miniaturization efforts
Solution Approach 1:
The cooling device segments the cooling function into multiple small fans with smaller individual sizes rather than one large fan. Each fan is positioned to generate airflow in a specific direction from separate openings. This segmentation allows the use of compact fans that fit within miniaturized device constraints while collectively achieving superior heat dissipation through intersecting airflow collision that thins the boundary layer and enhances the heat transfer coefficient
4Stability of the object's composition
If boundary layer thickness is increased for stable flow, then the flow stability improves, but the heat transfer coefficient decreases
Solution Approach 1:
The invention introduces dynamic airflow interaction through intersecting and colliding flow patterns from multiple directions. The collision of airflows creates localized turbulence and boundary layer thinning at the heat discharge surface, transforming the static, stable but inefficient thick boundary layer into a dynamic, actively renewing thin boundary layer. This dynamic flow interaction maintains sufficient flow stability while dramatically improving the heat transfer coefficient through continuous boundary layer disruption and renewal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling device achieves a heat transfer coefficient improvement of up to five to ten times that of traditional air cooling, effectively managing heat dissipation while minimizing noise and maintaining miniaturization.
Implementation Method 1
first and second air flows, by being caused to collide over the heat discharge surface, generate a collision jet
Implementation Method 2
the collision jet includes a swirl flow in a direction perpendicular to the heat discharge surface
Implementation Method 3
the collision jet... thins the boundary layer, enhancing the heat transfer coefficient
Implementation Method 4
a first air flow that flows over the heat discharge surface in a first direction toward a reference point set on the heat discharge surface; and a second air flow that flows over the heat discharge surface toward the reference point in a second direction that intersects with the first direction
Data Source
AI summary
A cooling device is provided that can thin a boundary layer and thus obtain the effect of sufficiently improving the heat transfer coefficient. The cooling device for an electronic apparatus that has a plurality of members juxtaposed such that the surfaces of the members confront each other, the surface of at least one member of these members having a heat discharge surface from which heat is discharged, includes: a duct (100) equipped with an opening (100a) whereby a first air flow emitted from the opening (100a) flows in a first direction along the heat discharge surface, and a duct (101) equipped with an opening (101a) whereby a second airflow emitted from the opening (101a) flows along the heat discharge surface in a second direction that intersects with the first direction. Taking as a boundary a line (200c) that passes through the center (200a) of the heat discharge surface, the center of the opening (101a) is located on the side opposite the side in which the opening (100a) is provided.