Intersecting Nozzles for Group-III Nitride Crystal Growth

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Solution Overview

Problem

In the production of Group-III nitride semiconductor crystals, the existing vapor-phase growth methods face challenges with the precipitation of crystals into the raw material gas introduction path and poor mixing of Group-III element-containing and nitrogen element-containing gases, leading to defects and reduced growth rates.

Innovation Solution

The apparatus features a raw material reaction chamber with a raw material nozzle and a nitrogen source nozzle that intersect before the board, creating a mixing area where the gases combine, along with a rotation mechanism for the board-holding member, which enhances gas mixing and suppresses crystal precipitation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If gases are supplied in parallel from perpendicular nozzles, then the raw material introduction path is simple, but the gases are not easily mixed together resulting in poor uniformity of film thickness and crystallinity

Engineering Contradiction:
Improveuniformity of film thickness and crystallinityVSAvoidraw material introduction path configuration
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The nitrogen source nozzle is configured with an asymmetric structure where the spray direction is inclined at a specific angle (e.g., 30-60 degrees) relative to the board surface, rather than being perpendicular. This asymmetric angle allows the nitrogen-containing gas to intersect with the Group-III element-containing gas flow, creating effective mixing while maintaining a relatively simple device structure.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The invention introduces a new spatial dimension by inclining the nitrogen source nozzle at an angle to the board surface, creating a three-dimensional gas flow pattern. The gases mix in a diagonal trajectory rather than in parallel layers, enabling thorough mixing without requiring complex multi-directional nozzle arrangements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If growth rate is increased to 10 μm/h or more using HVPE or OVPE methods, then productivity is improved, but crystal precipitation occurs in the raw material gas introduction path causing defects

Engineering Contradiction:
Improvecrystal growth rateVSAvoidcrystal quality and defect density
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The gases are mixed together in the gas phase before reaching the board surface, in advance of the crystal growth process. This preliminary mixing ensures homogeneous distribution of reactants, preventing local supersaturation that would cause crystal precipitation in the introduction path, thereby enabling high growth rates without quality degradation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The inclined nitrogen source nozzle acts as an intermediary device that facilitates thorough gas mixing in the intermediate region between the Group-III element source and the board. This intermediary mixing zone ensures uniform gas composition before deposition, preventing crystal precipitation while maintaining high growth rates.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves the mixing of gases, reduces crystal defects, and increases the transport efficiency of raw materials to the growth area, resulting in uniform gas distribution and enhanced growth rates.

Implementation Method 1

a raw material nozzle configured to spray a Group-III element-containing gas toward a board

Methodology Applied
Scientific EffectGas spray: Fluid Spray

Implementation Method 2

a nitrogen source nozzle configured to spray a nitrogen element-containing gas toward the board

Methodology Applied
Scientific EffectGas spray: Fluid Spray

Implementation Method 3

a mixing part in which a Group-III element-containing gas and a nitrogen element-containing gas are mixed together is formed

Methodology Applied
Scientific EffectGas mixing: Diffusion

Implementation Method 4

a mixing part in which a Group-III element-containing gas and a nitrogen element-containing gas are mixed together is formed

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 5

a heater configured to heat the raw material reaction chamber, the raw material nozzle, the nitrogen source nozzle, and the board-holding member in the raw material reaction chamber

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 6

a rotation mechanism configured to rotate the board-holding member in the raw material reaction chamber

Methodology Applied
Scientific EffectRotational motion:

Implementation Method 7

a Group-III element metal (for example, Ga metal) and an oxidant (for example, H2O gas) are reacted with each other to generate a Group-III element metal oxide gas (Ga2O gas)

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 8

GaN is grown from the Group-III element metal chloride and a nitrogen element-containing gas (for example, NH3 gas)

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS11186922B2Apparatus for producing Group-III nitride semiconductor crystal including nitrogen source nozzles with different spray directions
Publication Date: 2021.11.30 PANASONIC HOLDINGS CORP
  • US11186922B2 patent drawing
  • US11186922B2 patent drawing
  • US11186922B2 patent drawing

AI summary

An apparatus for producing a Group-III nitride semiconductor crystal includes a raw material reaction chamber, a raw material reactor which is provided in the raw material reaction chamber and configured to generate a Group-III element-containing gas, a board-holding member configured to hold a board in the raw material reaction chamber, a raw material nozzle configured to spray the Group-III element-containing gas toward the board, a nitrogen source nozzle configured to spray a nitrogen element-containing gas toward the board, in which, in a side view seen in a direction perpendicular to a vertical direction, a spray direction of the nitrogen source nozzle intersects with a spray direction of the raw material nozzle before the board, and a mixing part in which the Group-III element-containing gas and the nitrogen element-containing gas are mixed together is formed around the intersection as a center, a heater, and a rotation mechanism.