Intertwined Inductor Coils for High Inductance in ICs
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Solution Overview
Problem
Achieving high inductance values in integrated circuits is challenging due to the need for larger inductors, which compromises other device features, and existing three-dimensional inductors require multiple metal layers to increase inductance.
Innovation Solution
The formation of inductor coils using two levels of metallization with vias, where metal wires from different levels are interconnected to form intertwined coils with parallel magnetic axes, allowing for efficient energy transfer through inductive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If larger inductors are used to achieve high inductance values, then inductance is improved, but device area is increased at the expense of other device features
Solution Approach 1:
The patent transitions from planar inductor designs to three-dimensional vertical inductor structures by stacking multiple metal layers (e.g., metal layers 104, 106, 108, 110) vertically. This dimensional change allows the inductor to achieve high inductance values without proportionally increasing the device footprint, as the magnetic flux is generated in the vertical dimension rather than requiring large lateral area.
2Reliability
If a greater number of metal layers are used to achieve greater inductance in three-dimensional inductors, then inductance is improved, but device complexity is increased
Solution Approach 1:
The patent implements a nested structure where multiple metal layers are stacked vertically with each layer containing inductor windings that are coupled through vias. The metal layers are nested one above another (e.g., first metal layer 104, second metal layer 106, third metal layer 108, fourth metal layer 110), creating a compact vertical configuration that achieves high inductance without requiring an excessive number of layers, as each nested layer contributes to the overall magnetic flux generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of high-inductance transformer devices with compact designs, effectively enhancing inductance without the need for excessive metal layers, thereby optimizing device performance.
Implementation Method 1
One inductor coil through which an electric current is flowing, can produce a magnetic field and a changing magnetic field within an inductor coil induces a voltage across the ends of the coil via electromagnetic induction
Implementation Method 2
A transformer is a static electrical device that transfers energy by inductive coupling between its winding circuits. A varying current in the primary winding, i.e. inductor coil, creates a varying magnetic flux in the transformer's core and thus a varying magnetic flux through the secondary winding, i.e. inductor coil
Data Source
AI summary
Multiple intertwined inductor coils combine to form one or more transformer devices of a semiconductor device. The intertwined inductor coils are formed of only two metallization layers and vias coupling the layers. The inductor coils are vertically oriented and include a magnetic axis parallel to the substrate surface. A plurality of metal wires are provided on both a first device level and a second device level. Each of the metal wires on the first device level is coupled to two wires on the second device level and forms a first inductor coil. The two metal wires on the second device level that form part of the first inductor coil, are separated by a third wire that is coupled to two different first device level metal wires and forms part of a different second inductor coil intertwined with the first inductor coil.