Interwoven Nozzle Layout for Uniform Semiconductor Wafer Cleaning
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Solution Overview
Problem
Current semiconductor wafer cleaning processes face challenges in achieving uniform cleaning, particularly at the edges, due to the incompatibility of aqueous solutions with metal wiring, and the need for effective removal of contaminants without damaging the substrate, especially in the back end of line (BEOL) processing where metal areas are exposed.
Innovation Solution
A novel wet cleaning tool with a nozzle design that sprays de-ionized water and a carrier gas in an interwoven fashion, using separate passageways to ensure uniform fluid distribution and controlled flow rates, temperatures, and chemical reactions to effectively clean semiconductor wafers without reacting with metal surfaces, addressing the edge clean issue and ensuring substrate integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If aqueous solutions are used for cleaning semiconductor wafers, then cleaning effectiveness is improved, but compatibility with metal wiring deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the cleaning solution by using de-ionized water instead of traditional aqueous chemicals, and controls physical parameters such as spray pressure (3-30 psi) and temperature to achieve effective cleaning without chemical reactions with metal surfaces
Solution Approach 2:
The patent introduces carrier gas (nitrogen or dry air) as an intermediary substance that delivers the de-ionized water to the wafer surface, allowing controlled delivery of cleaning agents while preventing unwanted chemical reactions with metal wiring
2Device complexity
If traditional spray methods are used, then simplicity of the cleaning tool is maintained, but uniformity of cleaning distribution deteriorates
Solution Approach 1:
The patent segments the spray delivery system into separate passageways for de-ionized water and carrier gas, with multiple spray holes arranged to deliver fluids across different regions of the wafer, ensuring uniform distribution without requiring complex mechanical systems
Solution Approach 2:
The patent uses pneumatic principles by introducing carrier gas through separate passageways to deliver de-ionized water droplets to the wafer surface, creating an interwoven spray pattern that ensures uniform cleaning distribution through fluid dynamics rather than mechanical complexity
3Productivity
If high flow rates are used for spraying, then cleaning speed is improved, but fluid distribution control deteriorates
Solution Approach 1:
The patent optimizes flow rate parameters within a specific range (3-30 psi spray pressure) to balance cleaning speed with distribution control, and uses the ratio of carrier gas to water flow to control droplet formation and placement precision
Solution Approach 2:
The carrier gas acts as a mediator that controls the delivery and distribution of de-ionized water droplets, allowing high cleaning speed through increased flow while maintaining precise distribution control through the gas's flow characteristics and separate passageway delivery system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a more uniform cleaning distribution on semiconductor wafers, effectively removing contaminants while preventing damage to the substrate, particularly at the edges, and is applicable to both front end of line (FEOL) and back end of line (BEOL) processing stages.
Implementation Method 1
a nozzle configured to spray the de-ionized water and the carrier gas in an interwoven fashion
Implementation Method 2
controlled flow rates, temperatures, and chemical reactions to effectively clean semiconductor wafers
Data Source
AI summary
A semiconductor cleaning tool is provided. The cleaning tool comprises a nozzle. The nozzle is connected with a first inlet to receive a carrier gas and a second inlet to receive one or more fluids. The nozzle comprises a gas passageway connected to the first inlet; and fluid passageway connected to the second inlet. The gas passageway comprises gas passage branches and the fluid passageway comprises fluid passage branches. The gas passage branches and the fluid passage branches are arranged interweavingly in the nozzle. Individual gas/fluid passage branches are controllable indecently and separately including a flow rate, a temperature, an on/off state, a type of fluid(s) or carrier gas, a time period, a supply mode, and/or any other aspects of spraying the fluid(s) and carrier gas through the individual gas passage branches and the individual fluid passage branches.