Intraoral X-ray Sensor Asymmetric Cut Corners
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Solution Overview
Problem
Intraoral radiographic imaging sensors cause patient discomfort due to limited space and rigidity, leading to misalignment and pain during posterior maxillary and mandibular arch examinations, with existing digital sensors having significant dead space that limits image capture area.
Innovation Solution
The design of an intraoral x-ray imaging sensor with a housing and electronic interface substrate that minimizes dead space by relocating electrical components to the distal side, using a semiconductor imager with cut corners to accommodate the anatomy, and incorporating a wireless transmitter for improved ergonomics and image capture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If standard rectangular sensors are used in posterior maxillary and mandibular arches, then the sensor structure is simple and manufacturing is easy, but patient discomfort and misalignment occur due to limited space
Solution Approach 1:
The sensor employs an asymmetric design with cut corners (typically two opposite corners removed) to create a shape that conforms to the limited anatomical space in posterior maxillary and mandibular arches. This asymmetric geometry allows the sensor to fit into curved dental arches without causing discomfort or misalignment, while maintaining a relatively simple manufacturing process by modifying a standard rectangular substrate.
Solution Approach 2:
The sensor applies local quality by creating cut corners at specific locations where anatomical constraints are most severe. This localized modification allows the sensor to adapt to the specific geometry of posterior dental arches without requiring complete redesign of the entire sensor structure, thus balancing patient comfort with manufacturing simplicity.
2Area of stationary object
If electronic components are placed on the mesial side of the sensor, then electrical connections are simplified, but dead space increases reducing the image capture area
Solution Approach 1:
The sensor inverts the conventional placement of electronic components by positioning them on the distal side rather than the mesial side. This inversion allows the active imaging area to extend to the mesial edge, maximizing the image capture area. The component layout is redesigned to accommodate this inverted arrangement, optimizing both the imaging area and electrical connections.
Solution Approach 2:
The sensor utilizes the distal dimension for electronic component placement, effectively using the depth dimension of the sensor structure to resolve the conflict between component placement and imaging area. By moving components to the distal side, the mesial dimension is freed up for maximum image capture, thus optimizing the overall area utilization.
3Measurement precision
If solid-state sensors are used instead of film, then image quality and digital processing are improved, but rigidity increases causing greater patient discomfort
Solution Approach 1:
The rigid solid-state sensor is given an asymmetric shape with cut corners that allows it to conform to the curved anatomy of posterior dental arches. This geometric adaptation enables the rigid sensor to be comfortably inserted and positioned in limited spaces without causing excessive discomfort, while maintaining the high image quality benefits of solid-state technology.
Solution Approach 2:
The sensor modifies the geometric parameters of the rigid solid-state structure by removing corners and creating an asymmetric shape. This parameter change allows the rigid sensor to adapt to anatomical constraints, reducing patient discomfort while preserving the inherent advantages of solid-state imaging technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances patient comfort by reducing pain and improving image capture area, allowing for better radiographic coverage of teeth, especially in sensitive regions like the premolar and canine areas, while maintaining mechanical integrity and reducing shock damage.
Implementation Method 1
The semiconductor imager consists of a silicon layer having an array of detector elements formed on its first surface
Implementation Method 2
Each bond wire electrically couples one of the first electrical pads to one of the second electrical pads
Data Source
AI summary
An intraoral x-ray imaging sensor includes an electronic interface substrate which has a first surface and a second surface and is substantially rectangular with a mesial end and a distal end and a semiconductor imager which is mechanically and electrically coupled to the electronic interface substrate and which has a first surface and a second surface. The semiconductor imager consists of a silicon layer having an array of detector elements formed on its the first surface and is substantially rectangular with a mesial end and a distal end. The electronic interface substrate and the semiconductor imager have a first cut corner and a second cut corner at its the distal end. The second surface of the semiconductor imager is disposed adjacent and contiguous to the first surface of the electronic interface substrate. The intraoral x-ray imaging sensor also includes a plurality of first electrical pads, a plurality of second electrical pads and a plurality of bond wires. The first electrical pads are disposed on the first surface of the electronic interface substrate wherein some of the first electrical pads are disposed adjacent and contiguous to the first cut corner and the remainder of the first electrical pads are disposed adjacent and contiguous to the second cut corner. The second electrical pads are disposed on the first surface of the semiconductor imager wherein some of the of second electrical pads are disposed adjacent and contiguous to the first cut corner and the remainder of the second electrical pads are disposed adjacent and contiguous to the second cut corner. Each bond wire electrically couples one of the first electrical pads to one of the second electrical pads.