Invar Deposition Mask Plate With Low Inclusions for Uniform Through Holes

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Solution Overview

Problem

Existing deposition masks for OLEDs suffer from defects and non-uniformity in through holes due to metal plate inclusions, which affect deposition quality and reliability.

Innovation Solution

A metal plate with specific dimensions (900 mm to 1,100 mm length, 290 mm to 300 mm width, and 15 μm to 100 μm thickness, made of invar alloy, with controlled inclusion size and number to ensure a Defect Per Unit (DPU) of 10 or less, is used to manufacture deposition masks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal plate is used to manufacture a deposition mask, then the mask can be produced, but inclusions in the metal plate cause defects and non-uniformity in through holes

Engineering Contradiction:
Improvedeposition qualityVSAvoidthrough hole uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent specifies precise parameter ranges for the metal plate including thickness (15-100 μm), length (900-1100 mm), width (290-300 mm), and inclusion density (≤10 inclusions per unit area). By controlling these parameters, the patent ensures that inclusions do not adversely affect through hole uniformity and deposition quality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent differentiates between acceptable and unacceptable inclusion locations. Inclusions are permitted within the non-deposition region of the metal plate but must not be located in the deposition region where through holes are formed. This local quality approach allows the metal plate to be used while preventing inclusion-related defects in critical areas

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If inclusions are present in the metal plate, then the mask can be manufactured, but adjacent through holes may connect and deposition quality reduces

Engineering Contradiction:
Improvemask productionVSAvoiddeposition reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent sets a maximum inclusion density parameter of ≤10 inclusions per unit area and specifies that inclusions must not be located in the deposition region. This parameter control prevents inclusions from causing adjacent through holes to connect, thereby maintaining deposition reliability while allowing mask manufacturing to proceed

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent divides the metal plate into distinct regions: a deposition region where through holes are formed and a non-deposition region where inclusions are tolerated. This segmentation isolates the harmful effect of inclusions to non-critical areas, allowing manufacturing to continue without compromising deposition reliability

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20260085395A1Metal plate and deposition mask comprising same
Publication Date: 2026.03.26 LG INNOTEK CO LTD
  • US20260085395A1 patent drawing
  • US20260085395A1 patent drawing
  • US20260085395A1 patent drawing

AI summary

A metal plate according to an embodiment is a metal plate having a length (L) of 900 mm to 1,100 mm, a width (W) of 290 mm to 300 mm, and a thickness (T) of 15 μm to 100 μm, wherein the metal plate includes invar, the thickness of the metal plate is adjusted to a test thickness (X) of 3 μm to 10 μm to form a unit metal plate having a unit size of L*W*X, a number of inclusions per unit size of the unit metal plate is 10 or less, and the inclusion has a size exceeding the test thickness.