Metal Inverse Opal Cooling Assembly With Passive Capillary Flow

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Solution Overview

Problem

Metal-inverse-opal (MIO) structures used for cooling heat-generating devices experience large pressure drops when pumping coolant fluid through their network of small voids, leading to cooling and energy consumption inefficiencies.

Innovation Solution

A cooling assembly comprising a heat-generating device bonded to a metal inverse opal layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit, where the passive circuit allows coolant fluid to flow naturally through the MIO layer via capillary pressure, while the active circuit uses a pump and heat exchanger to replenish and cool the coolant fluid, avoiding pressure drops.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If coolant fluid is pumped through the MIO layer, then cooling effect is achieved, but large pressure drops occur leading to energy consumption inefficiencies

Engineering Contradiction:

Improvecooling effectVSAvoidenergy consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent replaces the mechanical pumping system with a passive capillary wicking structure. The MIO layer's porous structure utilizes capillary forces to draw coolant through the layer without requiring external mechanical pumps, thereby eliminating the energy consumption associated with pumping while maintaining effective cooling.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The cooling system is designed to be self-sustaining through the passive heat exchange circuit. The MIO layer automatically draws coolant from the reservoir through capillary action and returns it without external intervention, making the system self-service and eliminating the need for energy-consuming active pumping components.

Inventive Principle:

Principle #25Self-service

2Temperature

If coolant fluid is pumped through the MIO layer, then cooling effect is achieved, but system pressure drops increase

Engineering Contradiction:

Improvecooling effectVSAvoidpressure drop

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The patent substitutes mechanical pumping with passive capillary transport. The MIO layer's microstructure creates capillary forces that naturally drive coolant flow through the layer, eliminating the need for high-pressure pumping and thereby reducing system pressure drops while achieving effective cooling.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The MIO layer acts as an intermediary between the coolant reservoir and the heat-generating device. It uses its porous structure to mediate the coolant flow through capillary action, providing a low-pressure drop pathway for coolant delivery without requiring high-pressure pumping systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances cooling efficiency and reduces energy consumption by eliminating the need to actively pump coolant through the MIO layer, thereby minimizing pressure drops and improving thermal management.

Implementation Method 1

The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir

Methodology Applied

Scientific EffectCapillary pressure: Capillary Pressure

Implementation Method 2

The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir

Methodology Applied

Scientific EffectPumping: Pump

Implementation Method 3

The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 4

The MIO layer is bonded to the heat-generating device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11778780B2Cooling assemblies and methods

Publication Date: 2023.10.03 TOYOTA JIDOSHA KK

AI summary

In various embodiments, a cooling assembly includes a heat-generating device, a metal inverse opal (MIO) layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit. The MIO layer is bonded to the heat-generating device. The shared coolant reservoir contains a coolant fluid. The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir. The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir.