Through Board Inverted Connector Low Profile LED Design

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Solution Overview

Problem

Conventional surface-mounted electrical connectors have a high profile that can obstruct light emission in LED devices and are not suitable for densely packed electronic components, necessitating a reduction in connector height.

Innovation Solution

A connector assembly with a housing and contacts designed to be partially inserted through a substrate opening, featuring a tab and housing mounting surface that are coplanar with the contact mounting surface, allowing for a low profile configuration that does not obstruct light emission and can be securely mounted to a substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional surface-mounted connectors are used, then electrical connectivity is achieved, but the connector height profile becomes too large and obstructs light emission from LEDs

Engineering Contradiction:
Improveelectrical connectivityVSAvoidconnector height profile
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The connector is inverted and mounted on the bottom surface of the circuit board rather than the top surface. The housing is partially inserted through an opening in the board from the bottom side, with the mating interface positioned below the board. This inversion allows the connector to provide full electrical connectivity while maintaining a low profile above the board surface, preventing obstruction of LED light emission.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The connector mounting is moved from the traditional top-surface dimension to the bottom-surface dimension of the circuit board. By utilizing the z-dimension (thickness direction) and mounting from the opposite face, the connector achieves its functional length below the board while minimizing its profile above the board, thus resolving the height obstruction problem.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If connector height is reduced to accommodate densely packed electronic components, then space utilization improves, but manufacturing complexity increases

Engineering Contradiction:
Improvespace utilizationVSAvoidconnector structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The connector housing is divided into multiple segments: a first portion that protrudes through the board opening and a second portion that remains below the board. The contact assembly is also segmented with contacts having flat portions received in slots and angled portions engaging ledges. This segmentation allows each part to be optimized independently for low profile and secure mounting, achieving space efficiency without excessive overall complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The contact assembly is nested within the housing structure. The flat portions of the contacts are received into slots formed in the housing, and the angled portions engage with ledges formed in the housing. This nesting arrangement consolidates multiple components into a compact integrated structure that minimizes space requirements while maintaining manufacturing feasibility.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentEP2139079B1Through board inverted connector
Publication Date: 2016.03.23 TE CONNECTIVITY CORP
  • EP2139079B1 patent drawingFigure 1
  • EP2139079B1 patent drawingFigure 2
  • EP2139079B1 patent drawingFigure 3

AI summary

A connector assembly (104) is configured to be mounted to a substrate (118) that has an opening (116) extending between a mounting side (316) and an opposing side (318). The connector assembly (104) includes a housing (114) and one or more contacts (112). The housing (114) has a front end (216) and a back end (218), with an interior chamber extending inwards from a mating interface. The front end (216) of the housing (114) is configured to be partially inserted through the opening (116) in the substrate (118) until a housing mounting surface (208) engages the mounting side (316) of the substrate (118). The contact (112) extends between a mating end and a contact mounting surface (202). The contact mounting surface (202) is configured to be mounted to the mounting side (316) of the substrate (118). The housing mounting surface (208) and the contact mounting surface (202) are substantially coplanar in a mounting plane, and a distance between the mating interface and the mounting plane is at least as great as a thickness of the substrate (118).