Inverted Pyramid Heat Spreader Package with Dielectric Adhesive
Solution Overview
Problem
In electronic component packages, the small dimensions lead to inadvertent contact between heat spreaders and bond wires, causing shorting and failure due to the use of electrically conductive materials with high thermal conductivity.
Innovation Solution
An inverted pyramid heat spreader design with a dielectric adhesive between bond wires and the heat spreader, preventing direct electrical contact and using materials with high thermal conductivity for effective heat dissipation without electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat spreader is made of electrically conductive material with high thermal conductivity, then heat dissipation is improved, but inadvertent contact with bond wires causes shorting and package failure
Solution Approach 1:
A dielectric adhesive layer is introduced as an intermediary between the conductive heat spreader and the bond wires. This adhesive prevents direct electrical contact while maintaining thermal coupling, thus eliminating the shorting issue while preserving heat dissipation functionality.
Solution Approach 2:
The electrical conductivity parameter of the adhesive layer is changed to be dielectric (non-conductive), while its thermal conductivity is optimized to allow heat transfer. This parameter change enables the adhesive to simultaneously prevent electrical shorting and facilitate thermal management.
2Volume of moving object
If the dimensions of the electronic component package are reduced, then device miniaturization is achieved, but the risk of inadvertent contact between heat spreader and bond wires increases
Solution Approach 1:
The dielectric adhesive serves as a protective intermediary that maintains safe electrical isolation between the heat spreader and bond wires even when package dimensions are reduced. This allows continued miniaturization without proportionally increasing shorting risk.
Solution Approach 2:
The dielectric adhesive provides beforehand cushioning by pre-establishing an electrical isolation barrier before any potential contact can occur. This preventive measure cushions against the increased risk of shorting that arises from reduced package dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents shorting between bond wires and the heat spreader while efficiently dissipating heat from the electronic component, ensuring the package's reliability and performance.
Implementation Method 1
The second heatsink adhesive is a dielectric directly between the bond wires and the second heatsink that prevents inadvertent shorting between the bond wires and the second heatsink
Implementation Method 2
Heat generated by the electronic component is dissipated to the heat spreader thus avoiding overheating of the electronic component
Data Source
AI summary
A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an inactive surface mounted to the first surface of the substrate. The electronic component further includes an active surface having bond pads. Bond wires electrically connect the bond pads to the first traces. An inverted pyramid heat spreader includes a first heatsink, a first heatsink adhesive directly connecting the first heatsink to the active surface of the electronic component inward of the bond pads, a second heatsink having an absence of active circuitry, and a second heatsink adhesive directly connecting a first surface of the second heatsink to the first heatsink. The second heatsink adhesive is a dielectric directly between the bond wires and the second heatsink that prevents inadvertent shorting between the bond wires and the second heatsink.