Inverted Shielding Element for Compact Current Sensor
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Solution Overview
Problem
Current sensors face challenges in miniaturization and density improvements while maintaining sensing accuracy, particularly in vehicle systems, where existing designs often compromise on size due to the use of single Hall ICs and inadequate shielding.
Innovation Solution
The implementation of an inverted shielding element and a slotted printed circuit board within a non-magnetic housing, which includes a busbar with a recess for the shielding element, allows for a more compact design without sacrificing sensing accuracy, utilizing a rotary and linear position ASIC for multi-point calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single Hall IC is used for current sensing, then the device complexity is reduced, but the sensing accuracy and reliability deteriorate
Solution Approach 1:
The patent combines multiple Hall ICs (first and second Hall ICs) into a single sensor device, merging their sensing capabilities to achieve both differential current measurement and absolute position detection. This consolidation maintains functional integration while improving measurement precision through multi-point calibration and differential sensing, resolving the contradiction between device complexity and sensing accuracy.
2Object-affected harmful factors
If conventional shielding elements are used, then external magnetic interference is blocked, but the overall device size increases
Solution Approach 1:
The shielding element is nested within the housing structure, with the first and second Hall ICs positioned inside the housing and the shielding element forming a compact enclosure. This nested arrangement provides magnetic shielding while minimizing the overall device volume, as the shielding element utilizes the existing housing space rather than adding external protection layers.
Solution Approach 2:
Instead of placing the shielding element as a separate external component, the patent inverts the conventional approach by integrating the shielding element directly into the housing structure, allowing the Hall ICs to be positioned within the housing while the shielding element forms an inverted enclosure that reduces overall device size.
3Volume of moving object
If the sensor device is miniaturized, then the device density is improved, but the sensing accuracy deteriorates
Solution Approach 1:
The patent merges multiple sensing functions (differential current measurement and absolute position detection) into a single miniaturized device using combined Hall ICs. This merging allows the device to maintain high sensing accuracy through multi-point calibration and differential sensing while achieving miniaturization by consolidating multiple functions into one compact unit.
Solution Approach 2:
The patent transitions from conventional planar sensor layouts to a three-dimensional configuration where Hall ICs are positioned at different locations within the housing, utilizing vertical and spatial dimensions to achieve compact packaging while maintaining sensing accuracy through multi-point calibration in multiple dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall size of the current sensor while maintaining or improving sensing accuracy, effectively isolating the sensing element from external magnetic interference and enhancing the device's compactness.
Implementation Method 1
a shielding element surrounding the sensing element, wherein the shielding element extends through an opening of the substrate
Implementation Method 2
Some current sensors use a single Hall IC, which provides an output signal proportional to the flux density applied horizontally
Data Source
AI summary
A sensor device may include a substrate within the housing, a sensing element coupled to the substrate, and a shielding element surrounding the sensing element, wherein the shielding element extends through an opening of the substrate. The sensor device may further include a busbar extending through the housing, wherein the shielding element further extends through an indentation along at least one side of the busbar.