EV Inverter Power Module Base for Uniform Cooling Assembly
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Solution Overview
Problem
Inverters for electric vehicles face challenges in efficiently dissipating heat from power modules due to improper assembly and installation of cooling systems, leading to potential failure and high scrap rates, along with complex assembly processes that require significant testing and result in uneven thermal resistance and hot spots.
Innovation Solution
A base system with a body, rim, pin slots, and engagement slots, along with first and second apertures, is used to secure power modules to a substrate, providing uniform force distribution and electrical connections, and incorporating first and second plates to evenly apply compressive forces on heatsinks, enhancing thermal dissipation and assembly testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used to dissipate heat from power modules, then heat dissipation function is provided, but improper assembly and installation lead to thermal resistance unevenness and hot spots
Solution Approach 1:
The patent changes the geometric parameters of the base (adding curvature/concavity) to match the heatsink surface profile. This parameter modification enables uniform contact between the base and heatsink, eliminating thermal resistance unevenness caused by improper assembly while maintaining effective heat dissipation.
Solution Approach 2:
The base is pre-formed with a specific curved geometry that matches the heatsink surface before assembly. This preliminary shaping ensures that when the cooling system is assembled, uniform thermal contact is achieved automatically without requiring precise assembly adjustments, thus preventing hot spots.
2Reliability
If power modules are secured to substrate with conventional bases, then electrical connection is provided, but assembly complexity increases and testing requirements increase
Solution Approach 1:
The base is designed to perform multiple functions simultaneously: it provides mechanical support for the heatsink, ensures uniform thermal contact through its curved geometry, and establishes electrical connections via integrated contact terminals. This multi-functionality reduces overall assembly complexity by consolidating multiple components into one.
Solution Approach 2:
The patent merges the mechanical mounting function and electrical connection function into a single base component. The contact terminals are integrated directly into the base structure, eliminating the need for separate electrical connection components and simplifying both assembly and testing processes.
3Ease of manufacture
If conventional bases are used for power module assembly, then mounting is achieved, but thermal interface material distribution becomes uneven
Solution Approach 1:
The base geometry is modified with curved surfaces that match the heatsink profile, creating uniform gaps between the base and heatsink. This parameter change ensures even distribution of thermal interface material during assembly, preventing localized thermal resistance variations while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces thermal resistance, minimizes hot spots, and improves operational performance by ensuring even distribution of thermal interface material, facilitating reliable assembly and testing of power module assemblies before installation, thereby reducing scrap rates and enhancing cooling efficiency.
Implementation Method 1
Heatsinks may provide effective means of dissipating heat by thermally conducting heat into a fluid medium
Implementation Method 2
incorporating first and second plates to evenly apply compressive forces on heatsinks, enhancing thermal dissipation
Data Source
AI summary
A base for an electrical component includes: a body, the body defining: a rim, pin slots, and first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate.