Inverter Board Airflow Layout for Compact Induction Heaters
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Solution Overview
Problem
Induction heaters used in cooking devices face overheating issues due to high heating power, leading to potential damage and fire risks, especially in miniaturized designs where effective air cooling is lacking.
Innovation Solution
An induction heater design incorporating an inverter body with an inverter circuit board and a heat dissipater that includes an inverter heat dissipation blower to blow air into both the top and bottom surfaces of the circuit board, utilizing separate heat dissipation spaces and a heat sink to effectively dissipate heat, with an outlet divider to manage airflow and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If induction heater generates high heating power, then heating performance is improved, but temperature of inverter circuit board increases causing overheating risk
Solution Approach 1:
The patent divides the cooling system into multiple independent blowers (first blower for front surface, second blower for rear surface) and multiple air passage openings distributed across different locations. This segmentation allows targeted cooling of specific heat-generating areas, enabling high heating power operation while preventing localized overheating through distributed thermal management.
Solution Approach 2:
The patent implements localized cooling by providing separate air passage openings and blowers for different regions of the inverter circuit board (front surface openings with first blowers, rear surface openings with second blowers). Each region receives customized cooling based on its specific thermal load, allowing the system to maintain high power operation while managing temperature locally where needed.
2Volume of moving object
If induction heater is miniaturized to fit built-in kitchen furniture, then space efficiency is improved, but air cooling capability deteriorates
Solution Approach 1:
The patent compensates for the reduced overall size by implementing concentrated local cooling solutions. Multiple small air passage openings are distributed across the compact inverter circuit board, with dedicated blowers positioned to provide intensive cooling to specific heat-generating areas. This localized approach maintains effective cooling capability despite the miniaturized form factor.
Solution Approach 2:
The cooling system is segmented into multiple independent cooling channels corresponding to different regions of the miniaturized inverter circuit board. Each channel has its own air passage openings and blowers, allowing efficient thermal management within the compact volume by distributing cooling responsibilities across multiple parallel channels rather than relying on a single large cooling system.
3Reliability
If air cooling function is enhanced to prevent overheating, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent segments the cooling function into multiple independent blowers and air passage openings distributed across the inverter circuit board. This segmentation allows each component to be simpler and more specialized, with dedicated cooling channels for front and rear surfaces. The modular approach improves reliability through redundancy while keeping individual components relatively simple.
Solution Approach 2:
The patent provides localized cooling solutions with dedicated blowers and air passage openings for specific regions of the inverter circuit board. This targeted approach ensures reliable overheating prevention in critical areas without requiring complex cooling systems across the entire device. The local quality approach allows simpler overall system architecture by concentrating cooling resources where they are most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools both the front and rear of the inverter circuit board, preventing overheating, enabling miniaturization and integration of more devices while minimizing air leakage and ensuring reliable operation.
Implementation Method 1
a heat dissipater which is configured to blows air to a front and a rear of the inverter circuit board
Implementation Method 2
a heat sink which is provided on the top surface of the inverter circuit board, and wherein the heat sink dissipates heat from the inverter circuit board
Data Source
AI summary
Provided is an induction heater which induces an electric current in a metal utensil (e.g., a cooking utensil) using an electromagnetic force and can thus heat the metal utensil, and more particularly, an induction heater which can prevent electric devices sensitive to temperature from being overheated by forcefully blowing air to the front and the rear of an inverter circuit board. The induction heater is easy to be miniaturized, and a considerable number of devices can be integrated into the induction heater.