Inverter Capacitor Tray Assembly for Lower Thermal Resistance
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Solution Overview
Problem
Current inverter assembly methods are costly, inefficient, and suffer from poor heat dissipation due to positioning errors and thermal resistances between electronic components and the housing.
Innovation Solution
The inverter device employs a tray housing with defined caves filled with thermal conductive glue to securely position capacitors and busbar assemblies, reducing thermal resistance through strategic placement and soldering connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual or automated soldering processes are used to assemble electronic components on the circuit board, then electrical connections can be established, but positioning errors of the electrical components may lead to malfunction and assembly cost increases
Solution Approach 1:
The circuit board is pre-assembled with all electrical components soldered and positioned correctly before being installed in the housing. This preliminary assembly action ensures proper positioning and electrical connections are established in advance, avoiding positioning errors during final assembly and reducing assembly complexity.
Solution Approach 2:
The inverter device is divided into modular segments: the circuit board with pre-assembled electronic components, the housing with connectors, and the integrated assembly. This segmentation allows the complex electrical assembly to be prepared separately and then integrated, reducing overall assembly complexity and cost.
2Device complexity
If electronic components are mounted directly on the circuit board without additional heat conduction channels, then device complexity is reduced, but gaps between components and housing create thermal resistances resulting in poor heat dissipation
Solution Approach 1:
The housing serves multiple functions: it provides mechanical protection, structural support, and acts as a heat conduction channel. By making the housing thermally conductive and designing it to contact electronic components directly, it simultaneously performs structural and thermal management functions, eliminating the need for separate heat sinks and reducing device complexity.
Solution Approach 2:
The structural housing and heat conduction path are merged into a single integrated component. The housing is designed with direct contact surfaces for electronic components, combining mechanical support and thermal management functions into one element, thereby reducing the number of separate heat conduction channels needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances assembly efficiency and improves heat dissipation by minimizing thermal resistance, resulting in a more effective and cost-efficient inverter device.
Implementation Method 1
The first cave is filled with thermal conductive glue to adhere the first capacitors
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
The disclosure is directed to an inverter having a housing tray, multiple first capacitors, multiple second capacitors and a first busbar assembly. The housing tray has a carrying surface defined with first caves and second caves. The first capacitors are respectively adhered in the first caves with thermal glue, and the second capacitors are respectively adhered in the second caves with thermal glue. The first busbar assembly is stacked on the carrying surface and electrically connected to the first capacitors and the second capacitors.