Air Compressor Inverter Cooling via Integrated Case Radiator

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Solution Overview

Problem

Existing air compressors with inverter control units face issues with overheating, leading to operational deterioration and increased production costs due to the need for separate cooling of semiconductor switching elements, which complicates miniaturization and weight reduction.

Innovation Solution

An integrated cooling system where the heat generating components of the inverter control unit are mounted on a substrate within a case made of thermally conductive material, closely contacted with the case base, and cooled by air flow from fans, eliminating the need for separate wiring and allowing for efficient heat dissipation through a radiator plate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the inverter module is separated from the electric power supply module and mounted on a radiator plate, then the semiconductor switching element can be cooled effectively, but the device complexity increases and the air compressor size and weight increase

Engineering Contradiction:
Improvecooling efficiency of semiconductor switching elementVSAvoidstructural complexity of cooling system
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The inverter module is integrated directly onto the electric power supply module substrate, eliminating the need for a separate radiator plate. The case itself serves as the cooling structure, combining the housing and cooling functions into a single integrated component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The case is designed to serve multiple functions: it provides structural housing for the components and simultaneously acts as a radiator for heat dissipation. The air flow path is configured to cool both the compressor/motor and the inverter module through the same case structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If the inverter module is separated from the electric power supply module, then the semiconductor switching element can be cooled effectively, but the production cost increases due to additional wiring and assembly

Engineering Contradiction:
Improvecooling efficiency of semiconductor switching elementVSAvoidproduction cost and assembly complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The inverter module is mounted directly on the electric power supply module substrate, eliminating the need for separate wiring connections. This integration reduces the number of wiring steps and assembly operations required during manufacturing.

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If a wide surface area radiator plate is used to cool the inverter module, then the cooling efficiency improves, but the air compressor size and weight increase

Engineering Contradiction:
Improvecooling efficiency of inverter moduleVSAvoidweight of air compressor
Core Design Contradiction:
TemperatureVSWeight of stationary object

Solution Approach 1:

The case serves as the radiator structure, utilizing the existing housing material and structure for heat dissipation. This eliminates the need for an additional dedicated radiator plate, thereby avoiding the associated weight and space requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Temperature

If the circuit board and inverter module are disposed separately, then the heat generating component can be cooled effectively, but the wiring requirements increase and production cost increases

Engineering Contradiction:
Improvecooling of heat generating componentVSAvoidproduction cost due to wiring requirements
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The inverter module is integrated directly onto the electric power supply module substrate, eliminating the need for separate wiring connections between the circuit board and inverter module. This integration reduces the number of wiring steps and assembly operations required during manufacturing.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively cools the heat generating components, reduces the size and weight of the air compressor, and lowers production costs by integrating components and eliminating the need for additional wiring, while preventing insulation failures from dust and water.

Implementation Method 1

a cooling fan provided on a rotating shaft of the electric motor for generating cooling air which flows along the axial direction of the electric motor so as to cool the compressor, the electric motor and the heat generating component

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

a case made of thermally conductive material, closely contacted with the case base

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9528506B2Air compressor
Publication Date: 2016.12.27 MAX CO LTD
  • US9528506B2 patent drawing
  • US9528506B2 patent drawing
  • US9528506B2 patent drawing

AI summary

An inverter substrate in which heat generating components which make up an inverter control unit are mounted on a rear surface side thereof is accommodated in a case which is made of a material having a good thermal conductivity in such a manner that the heat generating components are closely contact with a base of the case. The case is provided between a pair of air tanks which are disposed parallel to each other at an interval and on a lower side of at least either of an electric motor and compressors in such a manner as to be oriented downwards so that the base is located at an upper position. An air flow generated by cooling fans which are driven by the electric motor is introduced to flow along the base of the case to thereby cool the heat generating components via the case.