Power Inverter Chassis Cooling Block Integration
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Solution Overview
Problem
There is a need for further downsizing of power inverters used for converting direct current to alternate current or vice versa, particularly in applications requiring environmental measures, where the existing power inverters are not optimized for size efficiency.
Innovation Solution
The power inverter design includes a metallic chassis with a cooling block forming a coolant path, power semiconductor modules, a capacitor module, and an alternate current busbar assembly, where the semiconductor modules are fixed within the coolant path and the busbar assembly is configured to extend along the coolant path for efficient cooling and compact layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power inverter uses conventional layout with separate cooling system and capacitor placement, then the cooling function is provided, but the overall volume is large and power-to-volume ratio is low
Solution Approach 1:
The patent merges the cooling block with the capacitor module housing, integrating two previously separate functions into a single structural component. The cooling block is positioned to receive coolant from the inverter circuit and directly cool the power semiconductor modules, while the capacitor module is mounted on the same structural platform, eliminating the need for separate cooling system housing and reducing overall inverter volume.
Solution Approach 2:
The cooling block serves multiple functions: it acts as a structural support component, a thermal management device for the power semiconductor modules, and a mounting platform for the capacitor module. This multi-functionality reduces the number of separate components needed, thereby decreasing the overall inverter volume while maintaining effective cooling.
2Volume of stationary object
If the power semiconductor modules are densely arranged for compactness, then the volume is reduced, but the cooling efficiency may be compromised
Solution Approach 1:
The cooling block is designed with localized cooling channels that are positioned in direct thermal contact with each power semiconductor module. The coolant flow path is optimized to deliver maximum cooling capacity to the hottest areas, ensuring that even in a densely arranged compact configuration, each module receives adequate cooling. The cooling structure adapts its geometry to match the thermal distribution of the power modules.
3Power
If the inverter circuit components are integrated closely for downsizing, then the power-to-volume ratio increases, but the reliability may be affected by heat management challenges
Solution Approach 1:
The cooling block acts as an intermediary thermal management component between the power semiconductor modules and the coolant system. It provides dedicated thermal pathways that efficiently transfer heat from the densely packed power modules to the flowing coolant, maintaining reliable operating temperatures despite the compact integration. The cooling block's thermal conduction properties ensure that heat is rapidly removed, preventing thermal runaway and maintaining system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the power-to-volume ratio of the power inverter, allowing for a more compact and efficient design while maintaining effective cooling and reliability, particularly suitable for applications in vehicles and industrial machines.
Implementation Method 1
a cooling block forming a coolant path on a side of the bottom in the vertical direction of the chassis along a side portion of the inner portion of the chassis
Implementation Method 2
the respective power semiconductor modules are fixed to the cooling block in a state of being inserted into the coolant path
Data Source
AI summary
A power inverter includes a metallic chassis having a containing space at an inner portion thereof, having a lid on one side in a vertical direction, the other side thereof being enclosed by a bottom, a cooling block of forming a coolant path along a bottom side in the vertical direction of the chassis, and a side portion of the inner portion of the chassis, plural semiconductor modules each incorporating a semiconductor chip for configuring an inverter circuit of converting a direct current power into an alternate current power, and provided with a direct current terminal for making a current flow to the semiconductor chip and a control terminal for controlling an operation of the semiconductor chip to be protruded to an outer portion.