Inverter Structural Element With Integrated Cooling and PCB Support
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Solution Overview
Problem
Inverter systems face challenges in effective thermal management, particularly in cooling the power module and printed circuit board (PCB), leading to improper operations and increased complexity and cost due to inadequate cooling methods and structural integrity issues.
Innovation Solution
A multi-functional structural element (MFSE) is introduced, which includes a heat sink and cooling channels, providing efficient heat dissipation and structural support while offering electromagnetic shielding and flexible mounting options for the PCB, reducing mechanical stress and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate cooling circuits are used for power module and PCB, then cooling effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent combines separate cooling circuits for the power module and PCB into a single integrated cooling circuit. The housing contains a coolant flow path that provides cooling to both the power module (through first cooling channels) and the PCB (through second cooling channels), eliminating the need for separate cooling systems while maintaining effective thermal management for both components.
Solution Approach 2:
The housing serves multiple functions: it provides structural support, electromagnetic shielding, and thermal management. The integrated cooling circuit within the housing simultaneously cools both the power module and PCB, making the housing a multi-functional component that addresses multiple system requirements through a single structure.
2Reliability
If multiple separate components are used for cooling and shielding, then functional effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the housing, cooling circuit, and electromagnetic shielding into a single integrated structure. This consolidation reduces the number of separate components that need to be manufactured and assembled, thereby reducing manufacturing complexity and cost while maintaining the functional effectiveness of thermal management and electromagnetic shielding.
Solution Approach 2:
The housing is designed as a multi-functional component that simultaneously provides structural support, thermal management through integrated cooling channels, and electromagnetic shielding. This multi-functionality eliminates the need for separate components for each function, reducing part count, assembly steps, and overall manufacturing cost.
3Ease of operation
If PCB is directly mounted to housing, then assembly simplicity is improved, but mechanical stress increases
Solution Approach 1:
The patent introduces a PCB support structure as an intermediary component between the PCB and the housing. This support structure is specifically designed to reduce mechanical stress on the PCB during assembly and operation, while still enabling straightforward mounting. The intermediary structure distributes and mitigates stress that would otherwise be directly transmitted to the PCB.
4Device complexity
If cooling channels are integrated in housing, then device complexity is reduced, but thermal management effectiveness may worsen
Solution Approach 1:
The housing contains different types of cooling channels optimized for different thermal requirements: first cooling channels for cooling the power module and second cooling channels for cooling the PCB. This localized optimization ensures that each component receives appropriate cooling through dedicated flow paths, maintaining thermal management effectiveness while achieving integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MFSE enhances thermal management, improves reliability, and reduces costs by enabling efficient cooling of inverter components, while simplifying assembly and providing effective EMC shielding.
Implementation Method 1
Cooling circuits may be used to transfer heat from the power module in order to cool the power module
Implementation Method 2
The housing and heat sink define a cooling circuit, the cooling circuit including a first cooling channel and a second cooling channel
Implementation Method 3
a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module
Implementation Method 4
the first surface of the heat sink is coupled to the second surface of the power module
Implementation Method 5
the multi-functional structural element is coupled to the heat sink by a thermal interface material
Data Source
AI summary
An inverter including: a housing including a first surface and a second surface opposite to the first surface; a power module including a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module; a multi-functional structural element, the multi-functional structural element including a first surface and a second surface, wherein the first surface of the multi-functional structural element contacts the second surface of the heat sink; and a printed circuit board, the printed circuit board being coupled to the second surface of the multi-functional structural element; wherein the housing and heat sink define a cooling circuit.