Integrated Double-Side Cooling Circuit for Inverter Power Modules

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Solution Overview

Problem

Inverter systems face challenges with improper cooling, leading to performance issues and increased complexity, cost, and leakage risks due to multiple heatsinks, which complicate assembly and increase scrap rates.

Innovation Solution

A single integrated cooling circuit within the inverter housing and heatsink, featuring a first channel defined by the housing and a second channel by the heatsink, with fins for enhanced cooling, and a hermetic seal to reduce complexity and leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple heatsinks are used to cool the power module, then cooling effectiveness is improved, but device complexity increases and assembly difficulty increases

Engineering Contradiction:

Improvepower module cooling effectivenessVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple heatsinks into a single integrated heatsink structure that cools multiple power semiconductors (IGBTs and diodes) simultaneously. This single heatsink includes multiple cooling channels and heat dissipation surfaces that replace what would traditionally require separate heatsinks, thereby reducing system complexity while maintaining effective cooling of all power module components.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If multiple heatsinks are used to cool the power module, then cooling effectiveness is improved, but ease of manufacture deteriorates

Engineering Contradiction:

Improvepower module cooling effectivenessVSAvoidassembly ease

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

By integrating multiple cooling functions into a single heatsink component, the patent reduces the number of parts that need to be manufactured and assembled. The single heatsink can be manufactured as one piece or pre-assembled unit, simplifying the manufacturing process and reducing assembly steps compared to installing multiple separate heatsinks on different power semiconductors.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If multiple heatsinks are used to cool the power module, then cooling effectiveness is improved, but reliability deteriorates due to increased leakage risks

Engineering Contradiction:

Improvepower module cooling effectivenessVSAvoidcoolant leakage risk

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The integrated heatsink design reduces the number of separate cooling circuits and connections required. Instead of having multiple independent coolant pathways through separate heatsinks, the single heatsink provides a unified cooling system with fewer seals and connections, thereby reducing potential leakage points and improving overall system reliability.

Inventive Principle:

Principle #5Merging (Combining)

4Temperature

If multiple heatsinks are used to cool the power module, then cooling effectiveness is improved, but cost increases

Engineering Contradiction:

Improvepower module cooling effectivenessVSAvoidnumber of components

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent reduces the total component count by using one integrated heatsink instead of multiple separate heatsinks. This reduction in the number of components directly lowers material costs, manufacturing costs, and assembly costs, while the integrated design maintains adequate cooling performance for all power semiconductors through its multiple internal cooling channels and heat dissipation surfaces.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated cooling system simplifies assembly, reduces costs, and minimizes coolant leakage while effectively managing thermal loads, enhancing performance and reliability.

Implementation Method 1

Cooling circuits may be used to transfer heat from the power module in order to cool the power module

Methodology Applied

Scientific EffectHeat transfer: Convection

Implementation Method 2

a heatsink coupled to the exterior surface of the inverter housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the heatsink further includes fins in the second channel

Methodology Applied

Scientific EffectHeat dissipation: Convection

Data Source

PatentUS12453062B2Systems and methods for integrated double side cooling of a power module of an inverter

Publication Date: 2025.10.21 BORGWARNER US TECHNOLOGIES LLC

AI summary

A system for an electric vehicle includes: an inverter housing including an inner wall, a first channel, and an exterior surface; and a heatsink coupled to the exterior surface of the inverter housing, the heatsink including a second channel; wherein the first channel in the inverter housing and the second channel in the heatsink define a cooling circuit, and wherein the first channel is fluidly connected to the second channel to pass a coolant through the cooling circuit.