Inverter Heat Sink With Temperature Equalizing Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation devices for inverters suffer from limited heat dissipation efficiency due to one-dimensional heat conduction capacity of heat pipes and reduced performance when bent, leading to inefficient heat transfer.
Innovation Solution
A heat dissipation device incorporating a heat sink base, a cooling module, and a temperature equalizing plate with part mounting seats, where the temperature equalizing plate acts as a two-dimensional heat-conduction structure, enhancing heat dissipation by conducting heat across its entire surface to the heat sink base and cooling module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If heat pipes are used for heat dissipation, then heat can be conducted from the heat sink base, but the one-dimensional heat conduction capacity limits the overall heat dissipation efficiency
Solution Approach 1:
The patent transitions from one-dimensional heat conduction through heat pipes to two-dimensional heat conduction through a temperature equalizing plate. The plate spreads heat laterally across its surface area before vertical conduction to cooling modules, fundamentally changing the heat flow geometry to improve dissipation capacity.
Solution Approach 2:
The temperature equalizing plate integrates multiple functions: it serves as a heat spreading element, a mounting platform for power devices, and a structural component that connects to multiple cooling modules. This consolidation improves heat dissipation efficiency without proportionally increasing device complexity.
2Ease of operation
If heat pipes are bent during assembly, then mounting flexibility is improved, but the heat transfer performance is reduced
Solution Approach 1:
The temperature equalizing plate provides a rigid, planar mounting surface that maintains dimensional stability. Unlike bent heat pipes, the plate does not require deformation for mounting, thereby preserving its thermal conduction properties while enabling flexible system integration through its stable geometry.
3Productivity
If multiple heat pipes are used to increase heat conduction power, then heat dissipation capacity improves, but the device complexity and processing difficulty increase
Solution Approach 1:
The patent consolidates the function of multiple heat pipes into a single temperature equalizing plate that provides two-dimensional heat spreading. This single component replaces what would otherwise require multiple separate heat pipe elements, reducing device complexity while achieving superior heat conduction power through area-based thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency by allowing heat to be dissipated quickly across the entire surface of the temperature equalizing plate and then conducted to the heat sink base and cooling module, overcoming the limitations of one-dimensional heat pipes and potential mounting issues.
Implementation Method 1
the temperature equalizing plate acts as a two-dimensional heat-conduction structure, enhancing heat dissipation by conducting heat across its entire surface to the heat sink base and cooling module
Implementation Method 2
a cooling module for dissipating heat from the heat sink base
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
A heat dissipation device of an inverter is provided disclosed by the present application, which includes a heat sink base, a cooling module and a temperature equalizing plate arranged on the heat sink base. The cooling module is configured to dissipate heat from the heat sink base, the temperature equalizing plate is provided with a part mounting seat, and the heat sink base is arranged between the cooling module and the temperature equalizing plate. When in use, the heat sink base is mounted on the cooling module, the temperature equalizing plate is mounted on the heat sink base, and a part is mounted on the part mounting seat. In the heat dissipation device provided by the present application, since the temperature equalizing plate serves as a two-dimensional planar heat-conduction structure, the heat of the part is dissipated through the entire surface of the temperature equalizing plate, and then the heat is conducted to the heat sink base and the cooling module far more quickly. Therefore, the heat dissipation efficiency of the heat dissipation device is improved.