Inverter Sealed Heat Insulating Layer for Thermal Management
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Solution Overview
Problem
Inverters with sealed cases, designed for high sealing performance like IP66, experience increased internal temperatures due to trapped heat, which shortens the life of passive components such as electrolytic capacitors, as they lack the heat resistance of power semiconductor modules and are unable to dissipate heat effectively.
Innovation Solution
The implementation of sealed heat insulating layers with a thickness equal to or less than the maximum convection suppressing distance between the cooler surface and the inverter case, preventing convection and maintaining high heat insulating performance, thereby reducing the temperature increase within the sealed case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealed case is used to achieve high sealing performance (IP66), then dust proofing and water proofing are improved, but heat dissipation deteriorates causing increased internal temperature
Solution Approach 1:
The sealed case is segmented into multiple sealed spaces by partition walls, with each space containing specific components. This segmentation allows different thermal management strategies for different components while maintaining overall sealing performance.
Solution Approach 2:
A sealed heat insulating layer is introduced as an intermediary between the cooler surface and the inverter case inner surface. This heat insulating layer mediates heat transfer, preventing convective heat conduction from the cooler to the case interior while maintaining the sealed environment.
2Volume of moving object
If the size of the inverter is reduced by using a smaller cooler, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The sealed heat insulating layer acts as an intermediary that directs heat flow away from the case interior, allowing the cooler to operate efficiently at higher temperatures without overheating the passive components, thus enabling compact inverter design.
Solution Approach 2:
The patent changes the thermal parameters by controlling the thickness of the heat insulating layer to be within a specific range (0.5mm to 5mm), which optimizes the balance between heat insulation performance and space utilization, enabling compact design while maintaining heat dissipation efficiency.
3Volume of moving object
If passive components are placed closer to the power semiconductor module to reduce inverter size, then device compactness is improved, but component reliability deteriorates due to increased temperature exposure
Solution Approach 1:
The sealed heat insulating layer serves as a thermal intermediary between the cooler surface and the inverter case, creating a thermal barrier that protects passive components from heat generated by the power semiconductor module, thereby maintaining component reliability in compact configurations.
Solution Approach 2:
The patent creates a separate sealed space for passive components that is thermally isolated from the power semiconductor module environment, effectively copying the protective function of external cooling to the internal component environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the temperature rise within the inverter case, extending the life of passive components and improving their reliability by preventing heat conduction and convection, while maintaining the high sealing performance of the inverter.
Implementation Method 1
a sealed heat insulating layer which is formed on the cooler surface and has a thickness equal to or less than a maximum convection suppressing distance
Implementation Method 2
a sealed heat insulating layer which is formed on the cooler surface and has a thickness equal to or less than a maximum convection suppressing distance
Data Source
AI summary
An inverter includes: an inverter circuit including: a power semiconductor module; and an inverter circuit module including a passive component; a cooler including a cooler surface to which the power semiconductor module is joined; an inverter case sealing the inverter circuit with the cooler surface of the cooler; and a sealed heat insulating layer being formed on the cooler surface of the cooler and having a thickness that is equal to or less than a maximum convection suppressing distance.