Inverter Insulator Substrate for Self-Aligned PCB Assembly

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Solution Overview

Problem

The assembly of inverter parts for electric vehicles is challenging due to precise alignment requirements, which can lead to assembly failures and component damage, and existing inverter boards often lack sufficient electrical isolation.

Innovation Solution

An alignment apparatus featuring an electrically insulative substrate with self-aligning features and routing features for low voltage conductors, which aids in aligning power module pins with circuit boards and provides electrical isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional assembly methods are used for inverter parts, then assembly process is simple, but alignment precision is insufficient leading to assembly failures

Engineering Contradiction:
Improvealignment precisionVSAvoidassembly process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The alignment apparatus incorporates pre-defined alignment features and self-aligning mechanisms that are prepared in advance. The alignment features on the substrate and corresponding features on circuit boards are designed beforehand to guide precise positioning during assembly, eliminating the need for complex real-time adjustment procedures.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The alignment apparatus serves as an intermediary device between the substrate and circuit boards. It provides a standardized interface with alignment features that mediate the positioning process, ensuring precise alignment without requiring direct complex interactions between components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If traditional inverter boards are used, then device structure is simple, but electrical isolation is insufficient leading to failures

Engineering Contradiction:
Improveelectrical isolationVSAvoidboard structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The inverter system is segmented into electrically isolated modules: the substrate, the alignment apparatus, and circuit boards. Each module maintains electrical independence through the insulative substrate and controlled routing features, preventing electrical interference while preserving functional integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The alignment apparatus acts as an electrical intermediary and isolation barrier between different circuit boards and the substrate. Its insulative properties and controlled routing features provide electrical separation, preventing harmful electrical interactions while allowing mechanical and functional integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If precise alignment is required during assembly, then assembly accuracy is improved, but assembly time increases

Engineering Contradiction:
Improvealignment accuracyVSAvoidassembly time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The alignment apparatus incorporates self-aligning features that automatically guide components into correct positions during assembly. The self-aligning mechanisms and pre-defined alignment features enable components to self-position without requiring complex external alignment tools or procedures, reducing assembly time while maintaining precision.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS12273044B2Inverter insulator apparatus and method
Publication Date: 2025.04.08 RIVIAN HOLDINGS LLC
  • US12273044B2 patent drawing
  • US12273044B2 patent drawing
  • US12273044B2 patent drawing

AI summary

Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.