Inverter-Integrated Electric Compressor Thermal Management
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Solution Overview
Problem
Inverter-integrated electric compressors face challenges in miniaturization due to increased size from space requirements for elastic members and vises, poor heat dissipation with glass epoxy boards, and high production costs and weight with metal boards, which also hinder noise suppression effectiveness.
Innovation Solution
A thermally-conductive control circuit board is directly placed on the heat-dissipating planar part without interposed spaces, using a substrate body of glass epoxy and heat-conducting through members like copper to enhance heat dissipation and reduce size, weight, and production complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a space is provided between the control circuit board and the electrical component for installing elastic members and vises, then the electrical component can be fastened to the heat-dissipating planar part, but the height of the inverter box increases
Solution Approach 1:
The patent removes the elastic member and vise from the assembly, extracting the fastening function to a simpler direct mounting approach. The electrical component is mounted directly on the control circuit board without requiring intermediate fastening mechanisms, thereby eliminating the need for additional space between components.
Solution Approach 2:
The patent merges the electrical component directly with the control circuit board, combining what were previously separate mounted components into an integrated assembly. This direct integration eliminates the need for fastening mechanisms and reduces the overall height of the inverter box.
2Ease of manufacture
If a glass epoxy board is used as the control circuit board substrate, then production cost is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a heat-conducting member as an intermediary between the electrical component and the control circuit board. This mediator transfers heat efficiently from the electrical component through the glass epoxy substrate to the heat-dissipating planar part, overcoming the poor thermal conductivity of the glass epoxy material while maintaining cost-effectiveness.
Solution Approach 2:
The patent creates a composite thermal management system combining the glass epoxy substrate with a heat-conducting member. This composite structure leverages the low-cost advantage of glass epoxy while compensating for its poor thermal conductivity through the integrated heat-conducting component.
3Temperature
If a metal board is used as the control circuit board substrate, then heat dissipation performance is improved, but weight and production cost increase
Solution Approach 1:
The patent applies local quality by using a heat-conducting member only where needed - specifically at the location of the electrical component that generates heat. Instead of making the entire control circuit board from metal, the solution locally enhances thermal conductivity only in the critical heat-generating area, reducing overall weight and cost while maintaining heat dissipation performance.
4Object-generated harmful factors
If the inverter box is made completely encapsulated for noise suppression, then electromagnetic noise is suppressed, but heat dissipation of electrical components deteriorates
Solution Approach 1:
The patent makes the control circuit board multi-functional by giving it both electrical insulation properties (for noise suppression) and heat conduction properties (for heat dissipation). The heat-conducting member embedded in the control circuit board enables thermal management while the encapsulated structure maintains electromagnetic shielding, allowing a single component to serve multiple functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools high heat-producing components, miniaturizes the inverter, reduces production costs, and enhances noise suppression while maintaining a compact and lightweight design.
Implementation Method 1
a control circuit board which serves as a thermally-conductive substrate, one surface of the thermally-conductive substrate is installed in a heat transferable manner on the heat-dissipating planar part, and the electrical component is provided in a heat transferable manner on the other surface of the thermally-conductive substrate
Data Source
AI summary
A control circuit board (25) configuring an inverter (21) serves as a thermally-conductive substrate. One surface of the control circuit board (25) is installed in a heat transferable manner on a heat-dissipating planar part (31) disposed on a housing (2), while heat-producing electrical components (39) are disposed in a heat transferable manner on the other surface of the control circuit board (25). The control circuit board (25) includes a substrate body (41) constituted of an insulator, and heat-conducting through members (42) constituted of a good thermal conductor filled through in a thickness direction of the substrate body (41). One end of each of the heat-conducting through members (42) is disposed in a heat transferable manner on the heat-dissipating planar part (31), and the electrical component (39) is disposed in a heat transferable manner on the other end.