Inverter Power Module Layout With Face-Contact AC Wiring
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Solution Overview
Problem
Existing power semiconductor devices face challenges in downsizing and reducing current loss, particularly in applications requiring high current flow such as in-vehicle use.
Innovation Solution
A power semiconductor device design featuring a first and second circuit body connected via an intermediate board with face-contact AC wiring patterns, allowing for minimized current paths and reduced contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional soldering connection is used between circuit bodies and lead frame, then assembly is straightforward, but current loss increases and device size cannot be reduced further
Solution Approach 1:
The patent merges the circuit board and lead frame into a single integrated structure. The circuit board serves dual functions as both the mounting substrate for circuit bodies and the current-carrying conductor, eliminating the need for separate lead frames and soldering connections. This integration directly reduces current loss by eliminating additional connection interfaces while managing the complexity through functional consolidation.
Solution Approach 2:
The patent extracts the lead frame function from the traditional hybrid structure and incorporates it directly into the circuit board through the through-hole configuration. The circuit board's conductive paths are extended through the substrate to provide current-carrying functionality, removing the need for separate collector-side lead frames and reducing the number of soldering joints required.
2Loss of energy
If more soldering connections are used to reduce current loss, then current path improves, but manufacturing complexity and time increase
Solution Approach 1:
By merging the circuit board and lead frame functions, the patent reduces the total number of soldering connections required. The integrated structure provides current paths through the circuit board itself, eliminating the need for additional lead frame attachments and multiple soldering operations, thereby improving manufacturing efficiency while maintaining low current loss.
3Loss of energy
If circuit board thickness is increased to accommodate through holes, then current path is shortened, but device size increases
Solution Approach 1:
The patent applies local quality by creating through-holes only in specific locations where current paths are needed, rather than uniformly increasing board thickness. The circuit board maintains its standard thickness overall, with localized through-hole pathways providing shortened current routes for the upper and lower arm circuit bodies, thus reducing current loss without increasing overall device dimensions.
4Loss of energy
If face contact connection is implemented, then current loss is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The integration of lead frame functionality into the circuit board creates fixed, pre-aligned current paths. The through-hole configurations and conductive patterns are manufactured as integral parts of the circuit board, providing built-in alignment references that reduce the need for high-precision manual alignment during assembly, thereby enabling face contact connections with manageable manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves downsizing and reduces current loss, enhancing manufacturing stability and efficiency while minimizing inductance and surge voltage.
Implementation Method 1
the intermediate board has an AC wiring pattern for transmitting the AC current
Data Source
AI summary
A power semiconductor device according to the present invention is provided with: a first circuit body constituting an upper arm of an inverter circuit for converting a DC current into an AC current; a second circuit body constituting a lower arm of the inverter circuit; and a circuit board that has therein a through-hole in which the first circuit body and the second circuit body are disposed and that has an intermediate board between the first circuit body and the second circuit body. The intermediate board has an AC wiring pattern for transmitting the AC current, and the first circuit body and the second circuit body are connected to the AC wiring pattern so as to be in surface contact with the AC wiring pattern.