Inverter Switching Module Layout for Compact Cooling Block Integration
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Solution Overview
Problem
Existing technologies face challenges in efficiently disposing switching elements and smoothing capacitors around a cooling block due to the large size of integrated semiconductor modules, leading to space constraints.
Innovation Solution
A switching element module configuration where the first and second switching elements are fixed to opposite sides of a cooling block, with the smoothing capacitor facing a connection surface between them, allowing for efficient placement and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If switching elements and smoothing capacitors are disposed around a cooling block, then cooling efficiency is improved, but the size of the semiconductor module increases
Solution Approach 1:
The patent divides the semiconductor module into separate modules (first semiconductor module with first switching element, second semiconductor module with second switching element, and capacitor module with smoothing capacitor) that can be independently disposed around the cooling block. This segmentation allows flexible spatial arrangement to optimize cooling efficiency while controlling overall size.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by disposing components on different faces and positions around the cooling block (first switching element on one side face, second switching element on opposite side face, smoothing capacitor on connection surface). This multi-dimensional disposition maximizes space utilization and improves cooling efficiency without proportionally increasing module size.
2Device complexity
If integrated semiconductor modules are used, then device integration is improved, but the size of one semiconductor module increases
Solution Approach 1:
Instead of using a single integrated semiconductor module, the patent segments the system into multiple smaller semiconductor modules (first and second switching elements in separate modules) and a separate capacitor module. This segmentation maintains functional integration while reducing the size of individual modules, allowing them to be efficiently arranged around the cooling block.
Solution Approach 2:
The patent transitions from a planar integrated module layout to a three-dimensional distributed arrangement around the cooling block. By disposing components on different faces and surfaces of the cooling block, the system achieves high integration without requiring large individual module sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient disposition of switching elements and smoothing capacitors around the cooling block, reducing the overall size of the vehicle drive device and improving cooling efficiency.
Implementation Method 1
a cooling block thermally connected to a cooler
Implementation Method 2
a cooling block thermally connected to a cooler
Data Source
AI summary
A switching element module includes a first switching element and a second switching element connected between a positive electrode and a negative electrode of a direct current power supply, a smoothing capacitor connected between the positive electrode and the negative electrode of the direct current power supply, and a cooling block thermally connected to a cooler. The first switching element is fixed to one side face of the cooling block. The second switching element is fixed to the other side face of the cooling block. The smoothing capacitor is fixed to a positive terminal of the first switching element and a negative terminal of the second switching element, and is provided to face a first connection surface of the cooling block that connects the one side face and the other side face.