EV Inverter Power Module Cooling With Parallel Dual-Sided Channels
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Solution Overview
Problem
Existing cooling strategies for electrified vehicle inverter power modules are inefficient due to high thermal resistance and manufacturing complexity, particularly with the use of thermal interface materials and mechanical clamping mechanisms, which hinder effective heat transfer and increase package size.
Innovation Solution
A dual-sided power module design with discrete cooling channels that supply coolant in parallel to each module, utilizing thermally conductive pin fins and a serpentine coolant path to enhance convective cooling, eliminating the need for pressure springs and thermal greases, and allowing for 3D printing of components for optimized cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material (thermal grease) is used to provide cooling, then cooling coverage is provided, but thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The patent removes the thermal interface material (thermal grease) from the cooling system. Instead of using grease between the power module and cooling plate, the design directly couples the cooling plate to the power module housing, eliminating the thermal resistance layer and improving heat transfer efficiency while maintaining effective cooling coverage.
Solution Approach 2:
The patent introduces a thermal conduit as an intermediary element that provides direct thermal coupling between the power module and cooling plate. This thermal conduit replaces the need for thermal grease and acts as a dedicated heat transfer pathway, reducing thermal resistance and improving overall heat transfer efficiency.
2Temperature
If mechanical clamping (spring) is used to secure power module, then conductive heat transfer is improved, but package size increases and manufacturing complexity increases
Solution Approach 1:
The patent removes the mechanical spring clamping mechanism from the design. Instead of using a spring to apply pressure for thermal contact, the design uses a rigid housing structure with integrated cooling plates that maintain direct thermal contact through precise mechanical fit-up, eliminating the need for complex assembly procedures.
Solution Approach 2:
The patent integrates the cooling plate directly into the housing structure, merging the cooling function with the structural enclosure. This integration eliminates separate clamping mechanisms and simplifies the overall design, reducing both package size and manufacturing complexity while maintaining effective heat transfer.
3Temperature
If conventional cooling channels are used, then cooling is provided, but thermal resistance remains high and cooling efficiency is insufficient
Solution Approach 1:
The patent segments the cooling system into multiple independent cooling channels, each dedicated to cooling specific power modules. This segmentation allows for optimized coolant flow distribution and reduces thermal resistance by providing direct, dedicated cooling pathways to each heat-generating component rather than using a single shared cooling system.
Solution Approach 2:
The patent transitions from conventional planar cooling channels to three-dimensional cooling pathways that extend through the housing structure. The cooling channels are positioned to maximize thermal contact with power modules from multiple directions, creating efficient heat transfer pathways that reduce thermal resistance and improve overall cooling effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases heat transfer efficiency, reduces thermal resistance and manufacturing complexity, and facilitates scalable cooling solutions by providing direct convective cooling to each module surface, ensuring maximum heat removal while minimizing package size.
Implementation Method 1
A first channel is configured to supply coolant from the inlet in parallel to a first edge of each chip... directing coolant from the inlet in parallel across the first and second chips... to a second channel
Implementation Method 2
The power modules include thermally conductive cooling pins in contact with surfaces of the first and second chips and extending within coolant flow areas between the first and second channels
Implementation Method 3
The third channel may include a serpentine portion associated with the conductive cooling pad
Data Source
AI summary
An inverter power module cooling system for an electrified vehicle includes an inlet coupled to channels providing coolant from a heat exchanger in parallel to a plurality of power modules along a first edge of associated chips having one or more switches, and channels collecting coolant from a second edge of associated chips. An additional serpentine channel receives coolant from the inlet to cool an associated area of a thermally conductive capacitor pad. The system may include a base plate having channels on one side and providing coolant to one side of the power modules and the capacitor pad, and a channel plate secured to an opposite side of the base plate to provide coolant to an opposite of the power modules. Cover plates may be provided to seal the channels of the base plate and channel plate, or may be integrally formed by molding or additive manufacturing.