Inverter Structural Element Integrating PCB Shielding and Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inverter systems face challenges in thermal management, particularly in cooling the power module and printed circuit board (PCB), leading to improper operations and increased complexity and cost due to inadequate cooling methods and structural integrity issues.
Innovation Solution
A multi-functional structural element (MFSE) is introduced, which includes a heat sink and a metal frame that covers the PCB, providing efficient heat dissipation and electromagnetic shielding, while allowing flexible mounting and reducing mechanical stress through optimized fixation points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling circuits are used for power module and PCB, then thermal management is achieved, but device complexity increases
Solution Approach 1:
The patent combines separate cooling functions into a single integrated cooling circuit that serves both the power module and PCB. The cooling circuit includes a cooling plate with first cooling channels for the power module and a housing with second cooling channels for the PCB, forming a unified thermal management system that reduces complexity while maintaining effective cooling for both components.
Solution Approach 2:
The cooling plate serves multiple functions: it acts as a heat sink for the power module, provides structural support, and forms part of the integrated cooling circuit. The housing simultaneously serves as structural enclosure and defines cooling channels for PCB thermal management, demonstrating multi-functionality that reduces overall system complexity.
2Object-affected harmful factors
If multiple separate components are used for structural support and electromagnetic shielding, then functional requirements are met, but assembly complexity increases
Solution Approach 1:
The patent merges the electromagnetic shielding function with the structural support function into a single multi-functional structural element. This element includes a shielding layer for electromagnetic protection and a structural layer for mechanical support, combining what would traditionally be separate components into one integrated unit that reduces assembly steps and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MFSE enhances thermal management, improves reliability, reduces assembly complexity, and lowers costs by enabling efficient cooling and structural support, while protecting PCB components from electromagnetic interference.
Implementation Method 1
Cooling circuits may be used to transfer heat from the power module in order to cool the power module
Implementation Method 2
thermal vias or passive cooling through an inverter housing may be used to cool the PCB
Implementation Method 3
the multi-functional structural element is metal and has a geometric cross section greater than the power module and is configured to completely cover the printed circuit board from an electromagnetic field projected from the power module
Implementation Method 4
a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module
Data Source
Figure 1
Figure 2
Figure 2A
AI summary
An inverter including: a housing including a first surface and a second surface opposite to the first surface; a power module including a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module; a multi-functional structural element, the multi-functional structural element including a first surface and a second surface, wherein the first surface of the multi-functional structural element contacts the second surface of the heat sink; and a printed circuit board, the printed circuit board being coupled to the second surface of the multi-functional structural element; wherein the housing and heat sink define a cooling circuit.