Inverter PCB Temperature Sensing via Semiconductor Connecting Pins
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Solution Overview
Problem
Existing methods for monitoring the temperature of power semiconductors in semiconductor packages are often expensive and complex, making them difficult to implement effectively.
Innovation Solution
An inverter assembly is proposed that includes a semiconductor package with external power connections and a connecting pin for a signal or control terminal. A temperature sensor is placed on a printed circuit board near the connecting pin, allowing it to measure the temperature transferred from the power semiconductor without direct contact, and is connected to an evaluation unit for overheating detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are integrated directly in power semiconductor packages, then temperature measurement accuracy is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent uses the connecting pin as an intermediary element to transfer temperature from the power semiconductor to the temperature sensor. The pin serves as a thermal conductor that bridges the gap between the semiconductor package and the sensor, allowing indirect temperature measurement without integrating the sensor directly into the package.
Solution Approach 2:
The temperature sensor measures the temperature of the connecting pin, which is a copy or proxy for the power semiconductor temperature. By measuring the pin's temperature instead of directly measuring the semiconductor, the system achieves temperature monitoring with simpler manufacturing.
2Speed
If temperature sensors are placed close to power semiconductors, then temperature measurement responsiveness is improved, but risk of direct thermal contact and interference increases
Solution Approach 1:
The connecting pin acts as a dedicated thermal intermediary that allows the temperature sensor to be positioned close to the power semiconductor without direct thermal contact. The pin transfers thermal information from the semiconductor to the sensor while maintaining physical separation.
Solution Approach 2:
The patent positions the temperature sensor on the printed circuit board in a different spatial dimension relative to the power semiconductor, using the vertical distance and the connecting pin as a thermal bridge. This dimensional arrangement allows close proximity for responsive measurement while preventing harmful direct contact.
3Ease of operation
If direct contact temperature measurement is used, then measurement simplicity is improved, but risk of damaging power semiconductors increases
Solution Approach 1:
The connecting pin serves as a safe intermediary that enables temperature measurement without direct contact between the sensor and power semiconductor. This eliminates the damage risk associated with direct contact while maintaining measurement simplicity through the established thermal pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective and simple method for temperature measurement, enabling effective overheating detection and protection of the power semiconductors, thereby preventing damage to the inverter system.
Implementation Method 1
measure the temperature transferred to the connecting pin from a power semiconductor in the semiconductor package
Implementation Method 2
a temperature sensor placed on the printed circuit board near the connecting pin, such that it can measure the temperature transferred to the connecting pin
Data Source
AI summary
An inverter assembly contains at least one semiconductor package with external electrical connections, and at least one external connecting pin for a signal or control terminal, a printed circuit board placed above and spaced apart from the semiconductor package, wherein the at least one connecting pin passes through a hole in the printed circuit board and is attached thereto, and a temperature sensor placed near the at least one connecting pin on the printed circuit board, such that it can measure the temperature of a power semiconductor in the semiconductor package transferred to the connecting pin.