EV Inverter Power Module Layout for Heat Dissipation and Insulation
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Solution Overview
Problem
Inverters for electric vehicles face challenges with thermal management due to the generation of heat by power modules, which can lead to incorrect operation and overheating, compromising the inverter's performance.
Innovation Solution
A power module design incorporating a first and second substrate with a conductive spacer and a flex circuit, where the semiconductor die is coupled to the substrates through the flex circuit, ensuring efficient heat dissipation and electrical insulation, and using conductive spacers to maintain spacing and provide an electrically conductive path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power modules are used to generate high voltage power, then the power output is improved, but heat generation increases causing thermal management issues
Solution Approach 1:
The power module is divided into two separate substrates (first substrate for drain connections, second substrate for source connections) with the semiconductor die mounted between them. This segmentation allows independent thermal management paths for each substrate, enabling more effective heat dissipation while maintaining high power output capability.
Solution Approach 2:
A flexible circuit board is introduced as an intermediary component between the semiconductor die and the two substrates. This flexible circuit serves as a thermal and electrical interface, allowing heat to be conducted from the die to both substrates while maintaining electrical connections. The flexible circuit acts as a mediator that enables dual-sided cooling without compromising electrical performance.
2Volume of moving object
If substrates are placed close together to reduce module size, then the volume is reduced, but electrical insulation between substrates becomes compromised
Solution Approach 1:
Electrically conductive spacers are positioned between the first and second substrates to maintain a precise gap while providing a defined electrical insulation barrier. These spacers act as intermediaries that allow the substrates to be placed close together for compactness while ensuring adequate electrical insulation. The spacers are strategically positioned at critical points where insulation is most needed.
Solution Approach 2:
The flexible circuit board serves as a thin film intermediary that provides both mechanical support and electrical insulation between the two substrates. Its flexible nature allows it to conform to the compact spacing requirements while maintaining the necessary insulation properties. The flexible circuit's thin profile enables close substrate placement without compromising insulation reliability.
3Ease of manufacture
If conventional power module design is used, then manufacturing is simplified, but thermal management and electrical insulation cannot be simultaneously optimized
Solution Approach 1:
By segmenting the power module into two separate substrates with the die mounted between them, the design allows each substrate to be optimized independently for its specific function (drain or source connections). This segmentation enables simultaneous optimization of thermal management paths and electrical insulation without complicating the overall manufacturing process, as each component can be prepared separately and then assembled.
Solution Approach 2:
The flexible circuit board and electrically conductive spacers serve as intermediary components that resolve the conflict between thermal management and electrical insulation requirements. These intermediaries can be integrated into the manufacturing process without significant complexity, providing dual-sided cooling capability and reliable insulation while maintaining ease of assembly through standardized mounting procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal management, reducing the risk of overheating and improving the operational efficiency and reliability of the inverter by maintaining electrical insulation and facilitating effective heat dissipation.
Implementation Method 1
a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate
Implementation Method 2
The layout and design of the power module affects the operation of the devices and the thermal characteristics of the power module
Data Source
AI summary
A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.