EV Inverter Power Module Substrates for Thermal Dissipation
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Solution Overview
Problem
Inverters for electric vehicles face challenges with thermal management due to heat generation by power modules, which can compromise their operation and efficiency.
Innovation Solution
A power module design incorporating a first and second substrate with electrically conductive spacers and a flex circuit to manage thermal dissipation and electrical connections, using materials like silicon nitride and metal for improved thermal conductivity and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power modules are used to generate high power in inverter, then power output is improved, but heat generation increases causing thermal management issues
Solution Approach 1:
The power module is divided into two separate substrates (first substrate for drain connections, second substrate for source connections) connected by electrically conductive spacers. This segmentation allows independent thermal management paths for each substrate, enabling more effective heat dissipation while maintaining high power output capability.
Solution Approach 2:
Electrically conductive spacers serve as intermediary elements connecting the first and second substrates. These spacers provide both electrical connection and thermal conduction pathways, acting as mediators that facilitate heat transfer from the semiconductor die to both substrates simultaneously, improving overall thermal management.
2Reliability
If electrically conductive spacers are used to connect substrates, then electrical connection is improved, but device complexity increases
Solution Approach 1:
The electrically conductive spacers perform multiple functions simultaneously: they provide electrical connection between substrates, serve as thermal conduction pathways, and act as mechanical support structures. This multi-functionality reduces the need for separate components, thereby reducing overall device complexity while improving electrical connection reliability.
Solution Approach 2:
The electrical connection function and thermal management function are merged into the same electrically conductive spacers. Instead of having separate electrical interconnects and thermal pathways, the spacers combine both functions, simplifying the overall structure while enhancing electrical connection reliability.
3Temperature
If ceramic materials are used in substrates, then thermal conductivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The design allows for parameter variations in the ceramic substrates and spacers while maintaining functional performance. By designing the system to accommodate reasonable dimensional tolerances and material property variations, the manufacturing precision requirements are reduced while still achieving the desired thermal conductivity performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management and electrical performance by maintaining efficient heat dissipation and reducing electrical interference, thereby improving the reliability and efficiency of the inverter system.
Implementation Method 1
a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate
Implementation Method 2
the first substrate further includes a middle section between the inner surface and the outer surface, wherein the middle section includes a ceramic, and the outer surface and the inner surface of the first substrate includes a metal
Data Source
AI summary
A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.